Inventor

CHUNG-SHI LIU

Inventor

TW

Overview

2021–2026

Patent span

Electricity

Primary field (CPC H)

Patents· 186 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1032%

H01LSemiconductor devices31%

H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1020%

G02BOptical elements, systems or apparatus3%

H05KPrinted circuits2%

H10DInorganic electric semiconductor devices2%

H01QAntennas, i.e. radio aerials1%

B29CShaping or joining of plastics1%

G06VImage or video recognition or understanding1%

Y10TTechnical subjects covered by former us classification1%

PatentTitleYear

12,593,632Method of implanting semiconductor donor substrate and method of manufacturing semiconductor-on-insulator structure2026 12,588,554Semiconductor device and method forming same2026 12,581,977Bonding through multi-shot laser reflow2026 12,557,661Package structure with antenna element2026 12,519,024Package structure comprising buffer layer for reducing thermal stress and method of forming the same2026 12,494,434Semiconductor packages and method of manufacturing the same2025 12,489,030Methods of manufacturing integrated fan-out packages with embedded heat dissipation structure2025 12,476,135Semiconductor package and method2025 12,469,756Warpage control of packages using embedded core frame2025 12,469,812Method for manufacturing semiconductor package with connection structures including via groups2025 12,431,446Package structure2025 12,418,0013D integrated circuit (3DIC) structure2025 12,412,817Integrated circuit package and method2025 12,406,961Integrated circuit package and method2025 12,406,941Dielectric slots underneath conductive vias in interconnect structure of semiconductor package and method of forming the same2025 12,400,936Stacked memory cube with integrated thermal path for enhanced heat dissipation2025 12,394,736Semiconductor package system and method2025 12,394,732Semiconductor package and method2025 12,394,242Fingerprint sensor device and method2025 12,381,163Semiconductor package and manufacturing method thereof2025 12,368,149Methods of forming semiconductor packages2025 12,368,141IPD modules with flexible connection scheme in packaging2025 12,358,194Molded semiconductor device and manufacturing method of molded semiconductor device2025 12,362,228Semiconductor package and method2025 12,354,924Integrated circuit package and method2025 12,354,969Semiconductor device and method of manufacture2025 12,356,558Electronic assembly having circuit carrier2025 12,345,740Probe card substrate, substrate structure and method of fabricating the same2025 12,334,446Semiconductor package and method2025 12,300,652Substrate and package structure2025 12,300,659Aligning bumps in fan-out packaging process2025 12,288,729Integrated circuit package and method2025 12,266,673Semiconductor package and method of forming the same2025 12,266,619Integrated devices in semiconductor packages and methods of forming same2025 12,260,669Fingerprint sensor in InFO structure and formation method2025 12,255,174Bonding passive devices on active dies to form 3D packages2025 12,230,597Package structure with warpage-control element2025 12,222,545Package and method of forming same2025 12,218,020Semiconductor packages2025 12,210,200Photonic semiconductor device and method of manufacture2025 12,205,923Semiconductor device, circuit board structure and manufacturing method thereof2025 12,205,860Sensor packages2025 12,193,168Circuit board and semiconductor device including the same2025 12,183,682Semiconductor package and manufacturing method thereof2024 12,176,282Manufacturing method of semiconductor package2024 12,170,267Semiconductor device and method of manufacture2024 12,164,158Package having prism structure and manufacturing method thereof2024 12,165,985Semiconductor device and method2024 12,159,851Package structure having hollow cylinders and method of fabricating the same2024 12,159,822Method of manufacturing a semiconductor package having conductive pillars2024 12,142,594Tools and systems for processing semiconductor devices, and methods of processing semiconductor devices2024 12,144,065Warpage control in the packaging of integrated circuits2024 12,142,560Semiconductor packages and methods of forming same2024 12,119,229Method of manufacturing semiconductor structure2024 12,119,238Semiconductor bonding structures and methods2024 12,107,051Method of forming semiconductor packages having through package vias2024 12,105,323Semiconductor package2024 12,094,728Semiconductor device2024 12,074,122Inductor structure, semiconductor package and fabrication method thereof2024 12,074,143Integrated circuit package and method2024 12,074,127Semiconductor die contact structure and method2024 12,057,359Semiconductor package and method of fabricating the same2024 12,051,650Semiconductor package and method2024 12,040,309Bonding through multi-shot laser reflow2024 12,040,281Semiconductor package structure comprising rigid-flexible substrate and manufacturing method thereof2024 12,033,883Fan-out interconnect structure and methods forming the same2024 12,021,037Method for manufacturing package structure2024 12,014,976Chip package structure including a silicon substrate interposer and methods for forming the same2024 12,011,859Molding apparatus and manufacturing method of molded semiconductor device2024 12,009,322Package structure with through-via in molding compound and dielectric layer2024 12,009,575Package structure2024 12,009,3453D package structure and methods of forming same2024 12,002,799Die stacking structure and method forming same2024 12,002,767Integrated circuit package and method2024 12,002,768Semiconductor package and manufacturing method thereof2024 11,984,375Integrated circuit package and method2024 11,984,374Warpage control of packages using embedded core frame2024 11,961,777Package structure comprising buffer layer for reducing thermal stress and method of forming the same2024 11,961,814Integrated circuit package and method2024 11,955,442Semiconductor package and method2024 11,955,460Advanced info POP and method of forming thereof2024 11,953,740Package structure2024 11,947,173Photonic semiconductor device and method of manufacture2024 11,942,464Semiconductor package and method2024 11,935,804Integrated circuit package and method2024 11,923,349Semiconductor structures2024 11,901,258Iintegrated fan-out packages with embedded heat dissipation structure2024 11,901,319Semiconductor package system and method2024 11,894,332Substrate and package structure2024 11,854,988Semiconductor device and method of manufacture2023 11,855,016Semiconductor device and method of manufacture2023 11,848,319Multi-chip semiconductor package2023 11,837,550Method of forming semiconductor packages having through package vias2023 11,837,575Bonding passive devices on active device dies to form 3D packages2023 11,817,380Semiconductor package and method of forming same2023 11,804,443Segregated power and ground design for yield improvement2023 11,798,925IPD modules with flexible connection scheme in packaging2023 11,776,945Package-on-package structure including a thermal isolation material2023 11,768,338Optical interconnect structure, package structure and fabricating method thereof2023 11,754,780Semiconductor package and manufacturing method thereof2023 11,749,535Semiconductor bonding structures and methods2023 11,749,626Integrated devices in semiconductor packages and methods of forming same2023 11,749,582Package structure2023 11,742,254Sensor package and method2023 11,741,737Fingerprint sensor in info structure and formation method2023 11,731,327Molding apparatus and manufacturing method of molded semiconductor device2023 11,727,714Fingerprint sensor device and method2023 11,721,659Package structure with warpage-control element2023 11,721,555Method and system for thinning wafer thereof2023 11,705,411Chip package with antenna element2023 11,699,598Semiconductor device2023 11,686,908Photonic semiconductor device and method of manufacture2023 11,665,834Electronic assembly having circuit carrier and manufacturing method thereof2023 11,664,350Semiconductor device and method of manufacture2023 11,664,287Packaged semiconductor devices and methods of packaging semiconductor devices2023 11,658,085Integrated circuit package and method2023 11,658,134Inductor structure, semiconductor package and fabrication method thereof2023 11,658,392Package structure2023 11,646,255Chip package structure including a silicon substrate interposer and methods for forming the same2023 11,640,935Semiconductor package and manufacturing method thereof2023 11,635,566Package and method of forming same2023 11,631,658Under-bump-metallization structure and redistribution layer design for integrated fan-out package with integrated passive device2023 11,626,339Integrated circuit package and method2023 11,625,940Fingerprint sensor device and method2023 11,614,592Semiconductor devices and methods of manufacture2023 11,602,056Circuit board and semiconductor device including the same2023 11,594,498Semiconductor package and method2023 11,594,484Forming bonding structures by using template layer as templates2023 11,569,183Package structure and method of fabricating the same2023 11,569,202Semiconductor device, circuit board structure and manufacturing method thereof2023 11,551,999Memory device and manufacturing method thereof2023 11,545,4653D package structure and methods of forming same2023 11,538,761Semiconductor package having molded die and semiconductor die and manufacturing method thereof2022 11,532,587Method for manufacturing semiconductor package with connection structures including via groups2022 11,532,596Package structure and method of forming the same2022 11,532,551Semiconductor package with chamfered semiconductor device2022 11,532,564Package structure2022 11,532,498Package-on-package structure2022 11,521,959Die stacking structure and method forming same2022 11,515,272Semiconductor die contact structure and method2022 11,506,843Semiconductor device having photonic and electronic dies and an optical fiber assembly creating an air gap2022 11,495,590Multi-chip semiconductor package2022 11,488,908Semiconductor device and method2022 11,488,897Integrated circuit package and method2022 11,462,507Bonding through multi-shot laser reflow2022 11,456,226Semiconductor package and method of fabricating the same2022 11,446,851Molding apparatus, manufacturing method of molded semiconductor device and molded semiconductor device2022 11,444,002Package structure2022 11,432,372Warpage control in the packaging of integrated circuits2022 11,417,698Semiconductor package and method of forming the same2022 11,417,633Integrated circuit package and method2022 11,417,638Semiconductor structures2022 11,410,953Via structure for packaging and a method of forming2022 11,404,342Package structure comprising buffer layer for reducing thermal stress and method of forming the same2022 11,390,000Wafer level transfer molding and apparatus for performing the same2022 11,387,171Method of packaging a semiconductor die2022 11,355,428Semiconductor package2022 11,355,471System for processing semiconductor devices2022 11,355,378Fan-out interconnect structure and methods forming the same2022 11,342,295Electronic assembly, package structure having hollow cylinders and method of fabricating the same2022 11,322,360Method of manufacturing semiconductor structure2022 11,282,761Semiconductor packages and methods of manufacturing the same2022 11,282,785Wireless charging package with chip integrated in coil center2022 11,270,921Semiconductor package including dies having high-modulus dielectric layer and manufacturing method thereof2022 11,264,342Package on package structure and method for forming the same2022 11,257,714Method of making a pillar structure having a non-metal sidewall protection structure and integrated circuit including the same2022 11,251,141Package structure2022 11,251,099Warpage control of packages using embedded core frame2022 11,245,176Package structure, electronic device and method of fabricating package structure2022 11,239,2013D integrated circuit (3DIC) structure2022 11,239,103Package-on-package structure2022 11,239,193Integrated circuit package and method2022 11,233,032Mechanisms for forming bonding structures2022 11,217,555Aligning bumps in fan-out packaging process2022 11,217,538Integrated circuit package and method2022 11,217,497Integrated circuit package and method2022 11,211,346Semiconductor device and method of manufacture2021 11,211,261Package structures and methods for forming the same2021 11,194,990Fingerprint sensor device and method2021 11,183,487Integrated circuit package and method2021 11,177,237Manufacturing method of semiconductor package2021 11,158,605Semiconductor packaging structure and method2021 11,152,323Package with UBM and methods of forming2021 11,145,614Semiconductor device and method of manufacture2021 11,139,177Method of fabricating semiconductor package structure2021 11,139,249Semiconductor devices and methods of forming the same2021

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2021–2026Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (186)· patent assignee history

2021–2026Based in TW· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
TAIWAN SEMICONDUCTOR MFG CO LTD	186	2021–2026

Locations

Location	Patents	Span
TW	186	2021–2026