Inventor
Ye-Chung Chung
Inventor
Hwaseong-si, KR
Overview
Patents· 19 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1036%
H05KPrinted circuits21%
G02FOptical devices or arrangements for the control of light by modification of the optical properties of the media of the elements involved therein19%
H01LSemiconductor devices8%
G09GArrangements or circuits for control of indicating devices using static means to present variable information6%
H10DInorganic electric semiconductor devices6%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h104%
Y10TTechnical subjects covered by former us classification2%
PatentTitleYear
10,699,974Film for package substrate, semiconductor package, display device, and methods of fabricating the film, the semiconductor package, the display device202010,607,939Semiconductor packages and display devices including the same202010,163,942Source driver, an image display assembly and an image display apparatus20189,557,616'Source driver, an image display assembly and an image display apparatus'20179,129,972'Semiconductor package'20158,222,089'Tape for heat dissipating member, chip on film type semiconductor package including heat dissipating member, and electronic apparatus including the same'20127,999,341'Display driver integrated circuit device, film, and module'20117,915,727'Tape for heat dissipating member, chip on film type semiconductor package including heat dissipating member, and electronic apparatus including the same'20117,902,647'TAB package connecting host device element'20117,732,933'Semiconductor chip and TAB package having the same'20107,683,471'Display driver integrated circuit device, film, and module'20107,652,366'Pad arrangement of driver IC chip for LCD and related circuit pattern structure of tab package'20107,649,246'Tab package connecting host device element'20107,459,779'Pad arrangement of driver IC chip for LCD and related circuit pattern structure of TAB package'20087,329,597'Semiconductor chip and tab package having the same'20087,217,990'Tape package having test pad on reverse surface and method for testing the same'20077,109,575'Low-cost flexible film package module and method of manufacturing the same'20067,087,987'Tape circuit substrate and semiconductor chip package using the same'20066,919,513'Film carrier tape for semiconductor package and manufacturing method thereof'2005Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2005–2020Patents assigned to SAMSUNG ELECTRONICS CO LTD (18)· patent assignee history
2005–2011Based in Suwon-si, KR· patent location history
2007Based in Kyungki-do, KR· patent location history
2008–2010Based in Gyeonggi-do, KR· patent location history
2011–2020Based in Hwaseong-si, KR· patent location history
2012–2017Patents assigned to CHUNG YE-CHUNG (3)· patent assignee history
2012–2015Patents assigned to CHO YOUNG-SANG (2)· patent assignee history
2012–2015Patents assigned to SON DAE-WOO (2)· patent assignee history
2012Patents assigned to CHO KYONG-SOON (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SAMSUNG ELECTRONICS CO LTD | 18 | 2005–2020 |
| CHUNG YE-CHUNGself | 3 | 2012–2017 |
| CHO YOUNG-SANG | 2 | 2012–2015 |
| SON DAE-WOO | 2 | 2012–2015 |
| CHO KYONG-SOON | 1 | 2012 |
Locations
| Location | Patents | Span |
|---|---|---|
| Hwaseong-si, KR | 7 | 2011–2020 |
| Suwon-si, KR | 7 | 2005–2011 |
| Gyeonggi-do, KR | 4 | 2008–2010 |
| Kyungki-do, KR | 1 | 2007 |