Inventor
Hemant D. Desai
Inventor
Gilbert, AZ, US
Overview
Patents· 19 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
B81Bprimary
B81BMicrostructural devices or systems, e.g. micromechanical devices22%
B81CProcesses or apparatus specially adapted for the manufacture or treatment of microstructural devices or systems19%
G01PMeasuring linear or angular speed, acceleration, deceleration, or shock16%
H10DInorganic electric semiconductor devices9%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h109%
G01LMeasuring force, stress, torque, work, mechanical power, mechanical efficiency, or fluid pressure7%
G01CMeasuring distances, levels or bearings3%
H01GCapacitors3%
Y10TTechnical subjects covered by former us classification3%
C23CCoating metallic material2%
PatentTitleYear
9,726,689'Wafer level micro-electro-mechanical systems package with accelerometer and gyroscope'20179,409,765'Method and apparatus for an isolating structure'20169,250,262'Method and apparatus for an integrated isolation mechanical filter with substrate based package'20169,233,836'Semiconductor device including accelerometer devices'20169,131,325'MEMS device assembly and method of packaging same'20158,921,203'Method of forming an integrated circuit having varying substrate depth'20148,692,337'Structure with a moving portion and a buried electrode for movement detection included in a multi-substrate configuration'20148,652,865'Attaching a MEMS to a bonding wafer'20148,525,316'Eutectic flow containment in a semiconductor fabrication process'20138,487,387'MEMS sensor device with multi-stimulus sensing'20138,461,656'Device structures for in-plane and out-of-plane sensing micro-electro-mechanical systems (MEMS)'20138,316,718'MEMS pressure sensor device and method of fabricating same'20128,216,882'Method of producing a microelectromechanical (MEMS) sensor device'20127,919,006'Method of anti-stiction dimple formation under MEMS'20117,846,815'Eutectic flow containment in a semiconductor fabrication process'20107,585,744'Method of forming a seal for a semiconductor device'20097,316,965'Substrate contact for a capped MEMS and method of making the substrate contact at the wafer level'20085,654,034'Composite thermocouple protection tubes'19975,102,694'Pulsed chemical vapor deposition of gradient index optical material'1992Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1992Based in Billerica, MA, US· patent location history
1997Based in Reading, MA, US· patent location history
2008–2016Patents assigned to FREESCALE SEMICONDUCTOR INC (14)· patent assignee history
2008–2017Based in Gilbert, AZ, US· patent location history
2012–2016Patents assigned to DESAI HEMANT D (9)· patent assignee history
2012–2014Patents assigned to PARK WOO TAE (5)· patent assignee history
2012–2015Patents assigned to SCHLARMANN MARK E (4)· patent assignee history
2013–2016Patents assigned to KARLIN LISA H (5)· patent assignee history
2015Based in Austin, TX, US· patent location history
2016Based in Chandler, AZ, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| FREESCALE SEMICONDUCTOR INC | 14 | 2008–2016 |
| DESAI HEMANT Dself | 9 | 2012–2016 |
| KARLIN LISA H | 5 | 2013–2016 |
| PARK WOO TAE | 5 | 2012–2014 |
| SCHLARMANN MARK E | 4 | 2012–2015 |
Locations
| Location | Patents | Span |
|---|---|---|
| Gilbert, AZ, US | 15 | 2008–2017 |
| Chandler, AZ, US | 1 | 2016 |
| Austin, Texas, US | 1 | 2015 |
| Reading, Massachusetts, US | 1 | 1997 |
| Billerica, Massachusetts, US | 1 | 1992 |