Inventor
KEN HACKENBERG
Inventor
US
Overview
Patents· 6 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices46%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1046%
F28FDetails of heat-exchange and heat-transfer apparatus, of general application8%
PatentTitleYear
12,272,614Integrated circuit packages with solder thermal interface materials with embedded particles202512,062,592Integrated circuit packages with thermal interface materials with different material compositions202411,798,861Integrated heat spreader (IHS) with heating element202311,791,237Microelectronic assemblies including a thermal interface material202311,710,672Microelectronic package with underfilled sealant202311,710,677Ultraviolet (UV)-curable sealant in a microelectronic package2023Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2023–2025Patents assigned to INTEL CORP (6)· patent assignee history
2023–2025Based in US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| INTEL CORP | 6 | 2023–2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| US | 6 | 2023–2025 |