Inventor
Shyue-Ter Leu
Inventor
Hsinchu, TW
Overview
Patents· 9 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices47%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1047%
H10DInorganic electric semiconductor devices5%
PatentTitleYear
10,797,006Structure and formation method of chip package with lid202010,727,147Semiconductor device and method of manufacture202010,163,816Structure and formation method of chip package with lid201810,109,547Semiconductor device and method of manufacture20189,881,908'Integrated fan-out package on package structure and methods of forming same'20189,870,975'Chip package with thermal dissipation structure and method for forming the same'20189,748,156'Semiconductor package assembly, semiconductor package and forming method thereof'20179,721,868'Three dimensional integrated circuit (3DIC) having a thermally enhanced heat spreader embedded in a substrate'20179,653,391'Semiconductor packaging structure and manufacturing method thereof'2017Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2017–2020Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (9)· patent assignee history
2017–2020Based in Hsinchu, TW· patent location history
2018Patents assigned to TAIWAN SEMICONDUCTOR MFG COMPANY LLC (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG CO LTD | 9 | 2017–2020 |
| TAIWAN SEMICONDUCTOR MFG COMPANY LLC | 1 | 2018 |
Locations
| Location | Patents | Span |
|---|---|---|
| Hsinchu, TW | 9 | 2017–2020 |