Inventor

Siqing Lu

Inventor

San Jose, CA, US

Overview

2002–2020

Patent span

Electricity

Primary field (CPC H)

Patents· 17 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H01Jprimary

H01JElectric discharge tubes or discharge lamps24%

H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1021%

C23CCoating metallic material18%

G01BMeasuring length, thickness or similar linear dimensions9%

G05DSystems for controlling or regulating non-electric variables6%

Y10TTechnical subjects covered by former us classification6%

B05BSpraying apparatus3%

H01LSemiconductor devices3%

H01MProcesses or means, e.g. batteries, for the direct conversion of chemical energy into electrical energy3%

H05HPlasma technique3%

PatentTitleYear

10,529,618Methods of manufacturing a semiconductor device2020 9,685,655'Complex showerhead coating apparatus with electrospray for lithium ion battery'2017 7,811,411'Thermal management of inductively coupled plasma reactors'2010 7,799,704'Gas baffle and distributor for semiconductor processing chamber'2010 7,789,993'Internal balanced coil for inductively coupled high density plasma processing chamber'2010 7,777,483'Method and apparatus for measuring a thickness of a layer of a wafer'2010 7,740,706'Gas baffle and distributor for semiconductor processing chamber'2010 7,722,719'Gas baffle and distributor for semiconductor processing chamber'2010 7,651,587'Two-piece dome with separate RF coils for inductively coupled plasma reactors'2010 7,572,647'Internal balanced coil for inductively coupled high density plasma processing chamber'2009 7,510,624'Self-cooling gas delivery apparatus under high vacuum for high density plasma applications'2009 7,355,394'Apparatus and method of dynamically measuring thickness of a layer of a substrate'2008 7,201,803'Valve control system for atomic layer deposition chamber'2007 7,112,961'Method and apparatus for dynamically measuring the thickness of an object'2006 6,734,020'Valve control system for atomic layer deposition chamber'2004 6,660,126'Lid assembly for a processing system to facilitate sequential deposition techniques'2003 6,461,435'Showerhead with reduced contact area'2002

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2002–2017Patents assigned to APPLIED MATERIALS INC (16)· patent assignee history

2002Based in Sunnyvale, CA, US· patent location history

2003–2017Based in San Jose, CA, US· patent location history

2020Patents assigned to SAMSUNG ELECTRONICS CO LTD (1)· patent assignee history

2020Based in Seongnam-si, KR· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
APPLIED MATERIALS INC	16	2002–2017
SAMSUNG ELECTRONICS CO LTD	1	2020

Locations

Location	Patents	Span
San Jose, California, US	15	2003–2017
Seongnam-si, KR	1	2020
Sunnyvale, California, US	1	2002