Inventor
Jieying KONG
Inventor
US
Overview
Patents· 9 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices40%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1040%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form5%
G02BOptical elements, systems or apparatus5%
H05KPrinted circuits5%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h105%
PatentTitleYear
12,557,628Organic film stress buffer for interface of metal and dielectric202612,512,397Substrates having adhesion promotor layers and related methods202512,442,979Optical waveguide formed within in a glass layer202512,191,240Hybrid glass core for wafer level and panel level packaging applications202512,125,777Minimizing package impedance discontinuity through dielectric structure optimizations202412,033,930Selectively roughened copper architectures for low insertion loss conductive features202411,780,210Glass dielectric layer with patterning202311,574,862Optimal signal routing performance through dielectric material configuration designs in package substrate202311,348,865Electronic device including a substrate having interconnects2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2026Patents assigned to INTEL CORP (9)· patent assignee history
2022–2026Based in US· patent location history
2025Patents assigned to THE INTEL CORP (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| INTEL CORP | 9 | 2022–2026 |
| THE INTEL CORP | 1 | 2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| US | 9 | 2022–2026 |