Inventor
Mei-Hui Sung
Inventor
Hsinchu, TW
Overview
Patents· 7 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Pprimary
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1045%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1027%
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices9%
H10DInorganic electric semiconductor devices9%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests9%
PatentTitleYear
7,012,027'Zirconium oxide and hafnium oxide etching using halogen containing chemicals'20066,689,695'Multi-purpose composite mask for dual damascene patterning'20046,647,994'Method of resist stripping over low-k dielectric material'20036,582,974'Method for forming a dual damascene aperture while employing a peripherally localized intermediate etch stop layer'20036,440,838'Dual damascene structure employing laminated intermediate etch stop layer'20026,380,090'Protecting method applied to the semiconductor manufacturing process'20026,024,802'Vapor treatment process for reducing oxide depletion'2000Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2000Patents assigned to WINBOND ELECTRONICS CORP (1)· patent assignee history
2000Based in Taichung, TW· patent location history
2002–2006Patents assigned to TAIWAN SEMICONDUCTOR MFG (5)· patent assignee history
2002Patents assigned to WINBOND ELECTRINICS CORP (1)· patent assignee history
2002–2003Based in Hsinchu, TW· patent location history
2003Based in Sen-Kan, TW· patent location history
2004–2006Based in Taoyuan, TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG | 5 | 2002–2006 |
| WINBOND ELECTRINICS CORP | 1 | 2002 |
| WINBOND ELECTRONICS CORP | 1 | 2000 |
Locations
| Location | Patents | Span |
|---|---|---|
| Hsinchu, TW | 3 | 2002–2003 |
| Taoyuan, TW | 2 | 2004–2006 |
| Sen-Kan, TW | 1 | 2003 |
| Taichung, TW | 1 | 2000 |