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Inventor

Takamasa Usui

Inventor
Tokyo, JP

Overview

73→
Patents
1998–2021
Patent span
Electricity
Primary field (CPC H)

Patents· 73 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1032%
B41JTypewriters20%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h109%
H01LSemiconductor devices8%
H10DInorganic electric semiconductor devices8%
H10BElectronic memory devices7%
C02FTreatment of water, waste water, sewage, or sludge3%
G01RMeasuring electric variables3%
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices2%
Y10TTechnical subjects covered by former us classification2%
PatentTitleYear
10,971,369Plasma processing method and plasma processing apparatus202110,879,137Template, template component, and semiconductor device manufacturing method202010,868,029Staggered semiconductor memory device202010,741,527Memory device202010,297,578Memory device20199,887,262'Semiconductor device'20189,589,974'Nonvolatile semiconductor memory device and method for manufacturing same'20179,504,127'Illumination apparatus management system and information communication terminal'20169,466,779'Piezoelectric actuator and method of manufacturing piezoelectric actuator'20169,196,609'Semiconductor device'20158,959,733'Method of manufacturing liquid transporting apparatus'20158,772,942'Interconnect structure employing a Mn-group VIIIB alloy liner'20148,716,134'Interconnect structure employing a Mn-group VIIIB alloy liner'20148,474,953'Droplet ejecting apparatus'20138,454,135'Air bubble removal in an ink jet printer'20138,456,186'Reliability evaluation test apparatus, reliability evaluation test system, contactor, and reliability evaluation test method'20138,377,822'Semiconductor device and manufacturing method thereof'20138,133,813'Semiconductor device with a barrier film'20128,044,519'Semiconductor device and method of fabricating the same'20118,029,115'Liquid ejection device'20118,020,981'Inkjet recording apparatus and air removal method therefor'20117,943,517'Semiconductor device with a barrier film'20117,944,053'Semiconductor device and method of manufacturing the same'20117,936,070'Semiconductor device and method for fabricating semiconductor device'20117,922,282'Cap apparatus for liquid jetting head and liquid jetting apparatus'20117,898,084'Semiconductor device'20117,888,253'Method of fabricating semiconductor device'20117,875,976'Semiconductor device including a silicide layer and a dielectric layer'20117,847,405'Semiconductor device and manufacturing method of semiconductor device'20107,810,899'Inkjet printer and printing head capping method'20107,786,523'Capacitor of dynamic random access memory and method of manufacturing the capacitor'20107,780,260'Inkjet printer and capping method'20107,755,202'Semiconductor device and method of fabricating the same'20107,750,473'LSI wiring pattern for reduced deformation and cracking'20107,735,956'Recovery device and recovery method'20107,661,805'Ink-jet printer'20107,651,184'Liquid droplet ejecting apparatus'20107,638,829'Capacitor of dynamic random access memory and method of manufacturing the capacitor'20097,600,869'Storage housing for storing recording head'20097,495,288'Semiconductor apparatus including a radiator for diffusing the heat generated therein'20097,485,915'Semiconductor device and method having capacitor and capacitor insulating film that includes preset metal element'20097,470,609'Semiconductor device and method for manufacturing the same'20087,410,248'Air bubble removal in an ink jet printer'20087,399,070'Ink jet printer'20087,364,279'Ink-jet printer with air-discharge-flow assuring means'20087,303,271'Ink jet printer'20077,304,384'Semiconductor device with a barrier film which contains manganese'20077,252,374'Ink-jet recording apparatus having ink-extracting member'20077,242,206'Reliability evaluation test apparatus, reliability evaluation test system, contactor, and reliability evaluation test method'20077,217,979'Semiconductor apparatus including a radiator for diffusing the heat generated therein'20077,205,664'Semiconductor device and method for manufacturing the same'20077,091,733'Reliability evaluation test apparatus, reliability evaluation test system, contactor, and reliability evaluation test method'20067,067,897'Semiconductor device'20067,049,701'Semiconductor device using insulating film of low dielectric constant as interlayer insulating film'20066,955,426'Ink jet printer'20056,946,387'Semiconductor device and method for manufacturing the same'20056,909,191'Semiconductor device'20056,886,926'Ink-jet printer with ink path and method of forming the ink path'20056,864,583'Wiring structure of semiconductor device'20056,805,438'Ink jet printer'20046,742,877'Ink-jet recording apparatus'20046,685,310'Ink-jet recording apparatus'20046,673,704'Semiconductor device and method of manufacturing the same'20046,642,622'Semiconductor device with protective layer'20036,609,792'Data transmission element for use in an ink-jet printer'20036,559,548'Wiring structure of semiconductor device'20036,440,843'Semiconductor device and method for manufacturing the same'20026,407,453'Semiconductor device and method of manufacturing the same'20026,110,647'Method of manufacturing semiconductor device'20006,091,080'Evaluation method for wirings of semiconductor device'20006,071,810'Method of filling contact holes and wiring grooves of a semiconductor device'20005,943,601'Process for fabricating a metallization structure'19995,759,915'Method of forming semiconductor device having an improved buried electrode formed by selective CVD'1998

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1998–2017Patents assigned to TOSHIBA KK (34)· patent assignee history
2000–2005Based in Kawasaki, JP· patent location history
2003–2016Patents assigned to BROTHER IND LTD (23)· patent assignee history
2003–2011Based in Ogaki, JP· patent location history
2006–2013Patents assigned to IBIDEN CO LTD (3)· patent assignee history
2006–2021Based in Tokyo, JP· patent location history
2007–2016Based in Nagoya, JP· patent location history
2010–2014Based in Selkirk, NY, US· patent location history
2012–2015Patents assigned to USUI TAKAMASA (7)· patent assignee history
2018–2020Patents assigned to TOSHIBA MEMORY CORP (5)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
TOSHIBA KK341998–2017
BROTHER IND LTD232003–2016
USUI TAKAMASAself72012–2015
TOSHIBA MEMORY CORP52018–2020
IBIDEN CO LTD32006–2013
Locations
LocationPatentsSpan
Tokyo, JP162006–2021
Ogaki, JP142003–2011
Kawasaki, JP92000–2005
Nagoya, JP72007–2016
Selkirk, New York, US62010–2014