Inventor
Tadayuki Into
Inventor
Tenri, JP
Overview
Patents· 3 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Pprimary
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1060%
B24BMachines, devices, or processes for grinding or polishing40%
PatentTitleYear
6,984,586'Method of thinning semiconductor wafer capable of preventing its front from being contaminated and back grinding device for semiconductor wafers'20066,582,223'Pickup apparatus for semiconductor chips'20036,520,844'Method of thinning semiconductor wafer capable of preventing its front from being contaminated and back grinding device for semiconductor wafers'2003Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2003–2006Patents assigned to SHARP KK (3)· patent assignee history
2003Patents assigned to SHARP TAKAYA ELECTRONIC INDUST (1)· patent assignee history
2003–2006Based in Tenri, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SHARP KK | 3 | 2003–2006 |
| SHARP TAKAYA ELECTRONIC INDUST | 1 | 2003 |
Locations
| Location | Patents | Span |
|---|---|---|
| Tenri, JP | 3 | 2003–2006 |