Inventor

Hiroyuki Obiya

Inventor

Kanagawa, JP

Overview

21→

Patents

1998–2009

Patent span

General tagging of new technological developments

Primary field (CPC Y)

Patents· 21 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

G03Fprimary

G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices20%

Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests18%

B24CAbrasive or related blasting with particulate material15%

H01JElectric discharge tubes or discharge lamps11%

Y10TTechnical subjects covered by former us classification8%

H05KPrinted circuits6%

C08FMacromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds5%

C08GMacromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds5%

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h103%

B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form2%

PatentTitleYear

7,563,146'Unbaked laminate for producing front plate of plasma display device, and method for producing front plate of plasma display device'2009 7,554,270'Composition for dielectric of plasma display panel, laminate for dielectric, and method for forming the dielectric'2009 7,402,376'Photosensitive resin composition and photosensitive dry film containing the same'2008 6,916,222'Process of making barrier ribs, electrodes, and the like for a plasma panel'2005 6,897,011'Photosensitive composition for sandblasting and photosensitive film using the same'2005 6,749,994'Photosensitive insulating paste composition and photosensitive film made therefrom'2004 6,641,628'Plastic abrasive for sandblasting, method for sandblast processing plasma display panel substrate using the same and method for treating sandblasting waste matters'2003 6,506,540'Photopolymerizable composition'2003 6,372,292'Insulating paste composition for rib formation and method of rib pattern formulation'2002 6,368,195'Plastic abrasive for sandblasting, method for sandblast processing plasma display panel substrate using the same and method for treating sandblasting waste matters'2002 6,322,947'Photosensitive composition for sandblasting and photosensitive film laminate comprising the same'2001 6,228,465'Process for producing multilayer wiring boards'2001 6,200,733'Photosensitive composition for sandblasting and photosensitive film comprising the same'2001 6,126,513'Plastic abrasive for sandblasting, method for sandblast processing plasma display panel substrate using the same and method for treating sandblasting waste matters'2000 6,054,545'Modified cellulose compound and photopolymerizable resin composition containing the same'2000 6,010,956'Process for producing multilayer wiring boards'2000 5,924,912'Photosensitive resin composition for sandblast resist'1999 5,919,569'Photosensitive resin composition and photosensitive resin laminated film containing the same'1999 5,916,738'Photosensitive resin composition for sandblast resist'1999 5,776,995'Photosensitive resin composition and photosensitive resin laminated film containing the same'1998 5,756,261'Photosensitive resin composition for sandblast resist'1998

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1998–2009Patents assigned to TOKYO OHKA KOGYO CO LTD (21)· patent assignee history

1998–1999Patents assigned to MATSUSHITA ELECTRONICS CORP (3)· patent assignee history

1998–2009Based in Kanagawa, JP· patent location history

1998–2009Based in Kawasaki, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
TOKYO OHKA KOGYO CO LTD	21	1998–2009
MATSUSHITA ELECTRONICS CORP	3	1998–1999

Locations

Location	Patents	Span
Kanagawa, JP	16	1998–2009
Kawasaki, JP	5	1998–2009