Inventor
EIJI NAKAMURA
Inventor
JP
Overview
Patents· 9 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
B23Kprimary
B23KSoldering or unsoldering16%
H01LSemiconductor devices16%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1016%
A61BDiagnosis5%
B23BTurning5%
C12QMeasuring or testing processes involving enzymes, nucleic acids or microorganisms5%
C23CCoating metallic material5%
G01NInvestigating or analysing materials by determining their chemical or physical properties5%
G02BOptical elements, systems or apparatus5%
G06NComputing arrangements based on specific computational models5%
PatentTitleYear
12,064,817Surface-coated cutting tool202411,969,828Prevention of dripping of material for material injection202411,720,801Chemical reaction network for estimating concentration of chemical species based on an identified pattern of output chemical species202311,684,988Prevention of dripping of material for material injection202311,660,026Restoring a wearable biological sensor202311,329,018Forming of bump structure202211,298,769Prevention of dripping of material for material injection202211,181,704Fabrication method of high aspect ratio solder bumping with stud bump and injection molded solder, and flip chip joining with the solder bump202111,164,845Resist structure for forming bumps2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021–2024Patents assigned to IBM (8)· patent assignee history
2021–2024Based in JP· patent location history
2024Patents assigned to MITSUBISHI MATERIALS CORP (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| IBM | 8 | 2021–2024 |
| MITSUBISHI MATERIALS CORP | 1 | 2024 |
Locations
| Location | Patents | Span |
|---|---|---|
| JP | 9 | 2021–2024 |