Inventor
Chee-Yee Chung
Inventor
Chandler, AZ, US
Overview
Patents· 26 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1029%
H05KPrinted circuits20%
Y10TTechnical subjects covered by former us classification11%
H02MApparatus for conversion between ac and ac, between ac and dc, or between dc and dc, and for use with mains or similar power supply systems7%
Y02PClimate change mitigation technologies in the production or processing of goods5%
G06FElectric digital data processing4%
H01GCapacitors4%
H01PWaveguides4%
H01RElectrically-conductive connections4%
H02JElectric power networks4%
PatentTitleYear
10,742,211Power sequencing in an active silicon interposer202010,312,813Multi-phase converter201910,141,849Multi-phase converter20189,966,842Parallel voltage regulator with switched capacitor or capacitor-inductor blocks20187,239,524'Resistive element apparatus and method'20077,176,565'Capacitors having separate terminals on three or more sides'20077,173,329'Package stiffener'20077,133,294'Integrated circuit packages with sandwiched capacitors'20067,109,569'Dual referenced microstrip'20066,946,824'Power delivery system having a plurality of stages and method for setting power delivery system parameters'20056,900,991'Electronic assembly with sandwiched capacitors and methods of manufacture'20056,877,223'Method of fabrication for a socket with embedded conductive structure'20056,717,277'Electrical assembly with vertical multiple layer structure'20046,686,819'Dual referenced microstrip'20046,680,218'Fabrication method for vertical electronic circuit package and system'20046,657,275'Pad and via placement design for land side capacitors'20036,636,416'Electronic assembly with laterally connected capacitors and manufacturing method'20036,584,685'System and method for package socket with embedded power and ground planes'20036,559,484'Embedded enclosure for effective electromagnetic radiation reduction'20036,558,181'System and method for package socket with embedded power and ground planes'20036,555,920'Vertical electronic circuit package'20036,509,640'Integral capacitor using embedded enclosure for effective electromagnetic radiation reduction'20036,428,358'Socket with embedded conductive structure and method of fabrication therefor'20026,392,301'Chip package and method'20026,362,438'Enhanced plated-through hole and via contact design'20026,346,743'Embedded capacitor assembly in a package'2002Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2002–2007Patents assigned to INTEL CORP (22)· patent assignee history
2002–2007Based in Chandler, AZ, US· patent location history
2018–2020Patents assigned to GOOGLE LLC (4)· patent assignee history
2018Patents assigned to GOOGLE INC (1)· patent assignee history
2018–2020Based in Milpitas, CA, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| INTEL CORP | 22 | 2002–2007 |
| GOOGLE LLC | 4 | 2018–2020 |
| GOOGLE INC | 1 | 2018 |
Locations
| Location | Patents | Span |
|---|---|---|
| Chandler, AZ, US | 22 | 2002–2007 |
| Milpitas, California, US | 4 | 2018–2020 |