Inventor
YU-SHEN CHEN
Inventor
TW
Overview
Patents· 5 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H05Kprimary
H05KPrinted circuits38%
H01LSemiconductor devices23%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1023%
H01HElectric switches8%
Y02PClimate change mitigation technologies in the production or processing of goods8%
PatentTitleYear
12,324,100Circuit board assembly and manufacturing method thereof202511,792,939Substrate with buried component and manufacture method thereof202311,670,520Package structure with interconnection between chips and packaging method thereof202311,523,505Embedded component structure and manufacturing method thereof202211,470,715Embedded component structure and manufacturing method thereof2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2025Patents assigned to UNIMICRON TECHNOLOGY CORP (5)· patent assignee history
2022–2025Based in TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| UNIMICRON TECHNOLOGY CORP | 5 | 2022–2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| TW | 5 | 2022–2025 |