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Inventor

Hsi-Feng Lin

Inventor
Taipei, TW

Overview

3→
Patents
2008–2015
Patent span
Mechanical engineering
Primary field (CPC F)

Patents· 3 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

G06Fprimary
G06FElectric digital data processing29%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1029%
F28DHeat-exchange apparatus, not provided for in another subclass, in which the heat-exchange media do not come into direct contact14%
F28FDetails of heat-exchange and heat-transfer apparatus, of general application14%
LOC2314%
PatentTitleYear
D0725257'Fan blade'20157,852,632'Heat dissipation module and detachable expansion card using the same'20107,436,667'Electronic device'2008

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2008–2015Patents assigned to ASUSTEK COMP INC (3)· patent assignee history
2008–2015Based in Taipei, TW· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
ASUSTEK COMP INC32008–2015
Locations
LocationPatentsSpan
Taipei, TW32008–2015