Inventor
KURTIS LESCHKIES
Inventor
US
Overview
Patents· 18 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices34%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1028%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1017%
B23KSoldering or unsoldering9%
H05KPrinted circuits8%
C23CCoating metallic material2%
F27BFurnaces, kilns, ovens or retorts in general2%
PatentTitleYear
12,518,986Laser ablation system for package fabrication202612,388,049High connectivity device stacking202512,374,611Package core assembly and fabrication methods202512,358,073Method and apparatus for laser drilling blind vias202512,087,679Package core assembly and fabrication methods202411,881,447Package core assembly and fabrication methods202411,862,546Package core assembly and fabrication methods202411,742,330High connectivity device stacking202311,705,365Methods of micro-via formation for advanced packaging202311,694,912High pressure and high temperature anneal chamber202311,676,832Laser ablation system for package fabrication202311,469,113High pressure and high temperature anneal chamber202211,462,417High pressure and high temperature anneal chamber202211,400,545Laser ablation for package fabrication202211,257,790High connectivity device stacking202211,232,951Method and apparatus for laser drilling blind vias202211,227,797Film deposition using enhanced diffusion process202211,177,128Apparatus and methods for manufacturing semiconductor structures using protective barrier layer2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021–2026Patents assigned to APPLIED MATERIALS INC (18)· patent assignee history
2021–2026Based in US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| APPLIED MATERIALS INC | 18 | 2021–2026 |
Locations
| Location | Patents | Span |
|---|---|---|
| US | 18 | 2021–2026 |