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Inventor

Tom Y. Chi

Inventor
San Gabriel, CA, US

Overview

12→
Patents
1992–2013
Patent span
Electricity
Primary field (CPC H)

Patents· 12 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Pprimary
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1019%
H10DInorganic electric semiconductor devices15%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1012%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests12%
A61BDiagnosis8%
A61HPhysical therapy apparatus, e.g. devices for locating or stimulating reflex points in the body8%
A61NElectrotherapy8%
G05BControl or regulating systems in general8%
Y02PClimate change mitigation technologies in the production or processing of goods8%
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices4%
PatentTitleYear
8,380,298'Magnetic acupuncture needle'20138,226,540'Acupuncture needle with magnetized handle'20127,174,230'Computer integrated manufacturing techniques'20077,069,101'Computer integrated manufacturing techniques'20065,705,432'Process for providing clean lift-off of sputtered thin film layers'19985,556,797'Method of fabricating a self-aligned double recess gate profile'19965,539,228'Field-effect transistor with high breakdown voltage provided by channel recess offset toward drain'19965,436,201'Dual etchant process, particularly for gate recess fabrication in GaAs MMIC chips'19955,378,926'Bonding of integrated circuit chip to carrier using gold/tin eutectic alloy and refractory metal nitride barrier layer to block migration of tin through via holes'19955,350,662'Maskless process for forming refractory metal layer in via holes of GaAs chips'19945,283,452'Distributed cell monolithic mircowave integrated circuit (MMIC) field-effect transistor (FET) amplifier'19945,156,998'Bonding of integrated circuit chip to carrier using gold/tin eutectic alloy and refractory metal barrier layer to block migration of tin through via holes'1992

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1992–1998Patents assigned to HUGHES AIRCRAFT CO (8)· patent assignee history
1992–1998Based in San Gabriel, CA, US· patent location history
2006–2007Patents assigned to APPLIED MATERIALS INC (2)· patent assignee history
2006–2007Based in San Jose, CA, US· patent location history
2012–2013Patents assigned to CHI TOM (2)· patent assignee history
2012–2013Based in South Fallsburg, NY, US· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
HUGHES AIRCRAFT CO81992–1998
APPLIED MATERIALS INC22006–2007
CHI TOMself22012–2013
Locations
LocationPatentsSpan
San Gabriel, California, US81992–1998
South Fallsburg, New York, US22012–2013
San Jose, California, US22006–2007