Inventor
Soo-San Park
Inventor
Seoul, KR
Overview
Patents· 32 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1073%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h107%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests5%
Y10TTechnical subjects covered by former us classification5%
B29CShaping or joining of plastics2%
B29LIndexing scheme associated with subclass b29c, relating to particular articles2%
H01LSemiconductor devices2%
H10DInorganic electric semiconductor devices2%
PatentTitleYear
8,906,740'Integrated circuit packaging system having dual sided connection and method of manufacture thereof'20148,810,018'Stacked integrated circuit package system with face to face stack configuration'20148,692,365'Integrated circuit packaging system with thermal dispersal structures and method of manufacture thereof'20148,692,388'Integrated circuit package system with waferscale spacer'20148,685,797'Integrated circuit packaging system with encapsulation and underfill and method of manufacture thereof'20148,581,380'Integrated circuit packaging system with ultra-thin die'20138,559,185'Integrated circuit package system with stackable devices and a method of manufacture thereof'20138,390,110'Integrated circuit packaging system with cavity and method of manufacture thereof'20138,383,458'Integrated circuit package system employing an offset stacked configuration and method for manufacturing thereof'20138,273,607'Integrated circuit packaging system with encapsulation and underfill and method of manufacture thereof'20128,247,893'Mountable integrated circuit package system with intra-stack encapsulation'20128,211,749'Integrated circuit package system with waferscale spacer'20128,189,344'Integrated circuit package system for stackable devices'20128,115,293'Integrated circuit packaging system with interconnect and method of manufacture thereof'20128,102,666'Integrated circuit package system'20128,093,727'Integrated circuit package-in-package system with side-by-side and offset stacking and method for manufacturing thereof'20128,067,307'Integrated circuit package system for stackable devices'20118,067,828'System for solder ball inner stacking module connection'20118,039,365'Integrated circuit package system including wafer level spacer'20118,004,073'Integrated circuit packaging system with interposer and method of manufacture thereof'20117,968,995'Integrated circuit packaging system with package-on-package and method of manufacture thereof'20117,923,290'Integrated circuit packaging system having dual sided connection and method of manufacture thereof'20117,872,340'Integrated circuit package system employing an offset stacked configuration'20117,863,761'Integrated circuit package system with molding vents'20117,829,986'Integrated circuit package system with net spacer'20107,812,435'Integrated circuit package-in-package system with side-by-side and offset stacking'20107,763,145'System for removal of an integrated circuit from a mount material'20107,687,919'Integrated circuit package system with arched pedestal'20107,659,609'Integrated circuit package-in-package system with carrier interposer'20107,652,376'Integrated circuit package system including stacked die'20107,456,088'Integrated circuit package system including stacked die'20087,238,258'System for peeling semiconductor chips from tape'2007Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2007–2014Patents assigned to STATS CHIPPAC LTD (32)· patent assignee history
2007–2014Based in Seoul, KR· patent location history
2011–2014Patents assigned to PARK SOO-SAN (18)· patent assignee history
2011–2014Patents assigned to LEE SANG-HO (14)· patent assignee history
2011–2014Patents assigned to CHOI DAESIK (6)· patent assignee history
2012–2014Patents assigned to HA JONG-WOO (6)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| STATS CHIPPAC LTD | 32 | 2007–2014 |
| PARK SOO-SANself | 18 | 2011–2014 |
| LEE SANG-HO | 14 | 2011–2014 |
| CHOI DAESIK | 6 | 2011–2014 |
| HA JONG-WOO | 6 | 2012–2014 |
Locations
| Location | Patents | Span |
|---|---|---|
| Seoul, KR | 32 | 2007–2014 |