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Inventor

Norihiko Ikeda

Inventor
Tokyo, JP

Overview

15→
Patents
2007–2020
Patent span
Chemistry
Primary field (CPC C)

Patents· 15 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

G03Fprimary
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices18%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1014%
C07DHeterocyclic compounds10%
C07CAcyclic or carbocyclic compounds8%
C09GPolishing compositions6%
C09KMaterials for miscellaneous applications, not provided for elsewhere6%
H01JElectric discharge tubes or discharge lamps6%
H01LSemiconductor devices6%
B24BMachines, devices, or processes for grinding or polishing4%
C07HSugars4%
PatentTitleYear
10,755,897Plasma processing apparatus and plasma processing method202010,699,884Plasma processing apparatus and plasma processing method202010,088,750Acid diffusion control agent, radiation-sensitive resin composition, resist pattern-forming method, compound, and production method20189,720,322'Photoresist composition, compound, and production method thereof'20179,588,423'Acid diffusion control agent, radiation-sensitive resin composition, resist pattern-forming method, compound, and production method'20179,477,149'Photoresist composition, compound, and production method thereof'20169,459,532'Radiation-sensitive resin composition, polymer and compound'20169,390,941'Sample processing apparatus, sample processing system, and method for processing sample'20169,329,474'Photoresist composition and resist pattern-forming method'20169,323,146'Photoresist composition, resist pattern-forming method, compound, acid generating agent, and photodegradable base'20168,182,977'Polymer and positive-tone radiation-sensitive resin composition'20128,157,877'Chemical mechanical polishing aqueous dispersion, chemical mechanical polishing method, and kit for preparing chemical mechanical polishing aqueous dispersion'20127,550,020'Chemical mechanical polishing aqueous dispersion and chemical mechanical polishing method'20097,252,782'Chemical mechanical polishing aqueous dispersion and chemical mechanical polishing method'20077,189,651'Stopper for chemical mechanical planarization, method for manufacturing same, and chemical mechanical planarization method'2007

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2007–2018Patents assigned to JSR CORP (12)· patent assignee history
2007–2020Based in Tokyo, JP· patent location history
2007–2009Based in Chuo-ku, JP· patent location history
2012–2016Patents assigned to IKEDA NORIHIKO (3)· patent assignee history
2012Patents assigned to HARADA SAKI (1)· patent assignee history
2012Based in Suzuka, JP· patent location history
2016–2020Patents assigned to HITACHI HIGH TECH CORP (2)· patent assignee history
2016Patents assigned to ARAMAKI TOORU (1)· patent assignee history
2016Based in Hiroshima, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
JSR CORP122007–2018
IKEDA NORIHIKOself32012–2016
HITACHI HIGH TECH CORP22016–2020
ARAMAKI TOORU12016
HARADA SAKI12012
Locations
LocationPatentsSpan
Tokyo, JP112007–2020
Chuo-ku, JP22007–2009
Hiroshima, JP12016
Suzuka, JP12012