Inventor

Akira Nagai

Inventor

Hitachi, JP

Overview

1986–2021

Patent span

Electricity

Primary field (CPC H)

Patents· 120 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1016%

Y10TTechnical subjects covered by former us classification13%

H05KPrinted circuits12%

C08LCompositions of macromolecular compounds8%

H02KDynamo-electric machines5%

C09JAdhesives5%

C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients4%

C08GMacromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds4%

C08FMacromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds4%

Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests3%

PatentTitleYear

D0912099Traveling machine for power shovels2021 10,848,039Method of manufacturing laminated rotor core2020 10,734,350Method for manufacturing semiconductor device2020 10,669,454Method for manufacturing semiconductor device including heating and pressuring a laminate having an adhesive layer2020 10,622,873Laminated rotor and method for balancing the same2020 10,508,726Fastening structure for flexible externally toothed gear of strain wave gearing and shaft member2019 10,419,213Key exchange method, key exchange system, key device, terminal device, and program2019 10,418,886Method for manufacturing laminated core2019 10,381,533Optical semiconductor element mounting substrate and optical semiconductor device using thermosetting resin composition for light reflection2019 10,283,264Method of manufacturing laminated core2019 10,224,311Semiconductor adhesive, and semiconductor device and method for manufacturing same2019 10,103,612Method and apparatus for manufacturing laminated iron core2018 9,947,464Method of manufacturing laminated core2018 9,803,111'Adhesive for semiconductor, fluxing agent, manufacturing method for semiconductor device, and semiconductor device'2017 9,768,673'Method of manufacturing laminated rotor core'2017 9,568,061'Brake pad for yaw control, and brake member'2017 9,564,790'Method for manufacturing laminated core'2017 9,548,644'Method of resin sealing permanent magnet and laminated core manufactured thereof'2017 9,431,883'Method of manufacturing laminated core having permanent magnets sealed with resin'2016 9,431,314'Thermosetting resin composition for sealing packing of semiconductor, and semiconductor device'2016 9,425,120'Semiconductor device and production method therefor'2016 9,387,608'Thermosetting resin composition for light reflection, method for manufacturing the resin composition and optical semiconductor element mounting substrate and optical semiconductor device using the resin composition'2016 9,318,923'Laminated iron core and method for manufacturing same'2016 9,202,622'Welding transformer and welding transformer assembly and welding apparatus'2015 8,922,084'Rotor core'2014 8,916,254'Method for manufacturing laminated core and laminated core'2014 8,615,146'Planar optical waveguide'2013 8,578,592'Method of manufacturing laminated rotor core'2013 8,420,210'Resin composition, prepreg, laminate sheet and printed wiring board using the same and method for production thereof'2013 8,273,458'Adhesive for bonding circuit members, circuit board and process for its production'2012 8,273,457'Adhesive for bonding circuit members, circuit board and process for its production'2012 8,252,419'Adhesive for bonding circuit members, circuit board and process for its production'2012 8,084,130'Epoxy resin molding material for sealing and electronic component device'2011 8,044,524'Adhesive for connection of circuit member and semiconductor device using the same'2011 8,034,659'Production method of semiconductor device and bonding film'2011 7,928,627'Laminated core and method for manufacturing the same'2011 7,879,445'Adhesive for bonding circuit members, circuit board and process for its production'2011 7,847,466'Laminated core and method for manufacturing the same'2010 7,777,387'Laminated core and method for manufacturing the same'2010 7,691,473'Fiber-reinforced composite material, method for manufacturing the same, and applications thereof'2010 7,692,296'Semiconductor device and multilayer substrate therefor'2010 7,455,901'Fiber-reinforced composite material, method for manufacturing the same and applications thereof'2008 7,273,900'Resin composition, prepreg, laminate sheet and printed wiring board using the same and method for production thereof'2007 7,247,381'Adhesive for bonding circuit members, circuit board, and method of producing the same'2007 7,217,992'Semiconductor device, semiconductor wafer, semiconductor module, and a method of manufacturing semiconductor device'2007 7,202,570'Circuit tape having adhesive film semiconductor device and a method for manufacturing the same'2007 7,193,009'Electronic device using low dielectric loss tangent insulators for high frequency signals'2007 7,112,627'Low dielectric loss tangent films and wiring films'2006 7,091,620'Semiconductor device and manufacturing method thereof'2006 7,038,325'Wiring tape for semiconductor device including a buffer layer having interconnected foams'2006 6,998,958'Remote control system for a vehicle'2006 6,994,806'Conductive paste'2006 6,989,600'Integrated circuit device having reduced substrate size and a method for manufacturing the same'2006 6,940,162'Semiconductor module and mounting method for same'2005 6,888,230'Semiconductor device, semiconductor wafer, semiconductor module, and a method of manufacturing semiconductor device'2005 6,878,448'Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same'2005 6,855,952'Semiconductor device and semiconductor package'2005 6,841,628'Resin composition, adhesives prepared therewith for bonding circuit members, and circuit boards'2005 6,791,194'Circuit tape having adhesive film, semiconductor device, and a method for manufacturing the same'2004 6,784,541'Semiconductor module and mounting method for same'2004 6,778,065'Remote control system for a vehicle'2004 6,710,446'Semiconductor device comprising stress relaxation layers and method for manufacturing the same'2004 6,689,296'Conductive paste'2004 6,670,883'Remote control system for a vehicle door'2003 6,638,352'Thermal stable low elastic modulus material and device using the same'2003 6,639,323'Semiconductor device and its manufacturing method'2003 6,638,631'Thermal stable low elastic modulus material and device using the same'2003 6,627,997'Semiconductor module and method of mounting'2003 6,621,154'Semiconductor apparatus having stress cushioning layer'2003 6,573,615'Electronic key system for a vehicle'2003 6,515,371'Semiconductor device with elastic structure and wiring'2003 6,489,013'Resin compound, and adhesive film, metal-clad adhesive film, circuit board, and assembly structure, using the resin compound'2002 6,452,780'Capacitor'2002 6,433,440'Semiconductor device having a porous buffer layer for semiconductor device'2002 6,430,027'Pulse generating capacitor'2002 6,423,571'Method of making a semiconductor device having a stress relieving mechanism'2002 6,396,145'Semiconductor device and method for manufacturing the same technical field'2002 6,348,741'Semiconductor apparatus and a manufacturing method thereof'2002 6,328,844'Filmy adhesive for connecting circuits and circuit board'2001 6,307,269'Semiconductor device with chip size package'2001 6,297,073'Semiconductor device'2001 6,223,429'Method of production of semiconductor device'2001 6,184,577'Electronic component parts device'2001 6,130,112'Semiconductor device'2000 6,114,753'Circuit tape having adhesive film, semiconductor device, and a method for manufacturing the same'2000 6,114,005'Laminate and multilayer printed circuit board'2000 6,097,100'Resin sealed semiconductor devices and a process for manufacturing the same'2000 6,049,128'Semiconductor device'2000 6,028,364'Semiconductor device having a stress relieving mechanism'2000 5,993,683'Piezoelectric ceramic'1999 5,965,057'Piezoelectric ceramic and manufacturing method thereof'1999 5,766,502'Piezoelectric ceramics and manufacturing method thereof'1998 5,707,749'Method for producing thin film multilayer wiring board'1998 5,703,414'Anti-theft apparatus which permits the engine to start prior to ID signal discrimination'1997 5,686,883'Vehicle anti-theft system'1997 5,677,045'Laminate and multilayer printed circuit board'1997 5,621,380'Vehicle anti-theft device'1997 5,598,898'Vehicle antitheft system'1997 5,565,536'Polymerizable compouund, process for producing same and setting composition containing polymerizable compound'1996 5,472,563'Printed circuit board and method and apparatus for making same'1995 5,410,069'Polymerizable compound, process for producing same and setting composition containing polymerizable compound'1995 5,380,875'Hydroxyproline derivatives and preparative process therefor'1995 5,352,762'Multilayer printed circuit board and production thereof'1994 5,308,888'Fluorine-containing curable resin composition and use thereof'1994 5,223,594'Flame-retardant resin composition containing a bromostyrene prepolymer'1993 5,212,244'Thermosetting resin composition, and prepreg and laminated sheet which use the same'1993 5,098,971'Fluorine-containing thermosetting resin'1992 5,080,965'Prepreg from poly(p-hydroxystyrene), epoxy-modified polybutadiene and maleimide'1992 5,065,285'Multi-layer circuit board, method of manufacturing the same and application thereof'1991 5,045,381'Thermosetting resin composition, printed circuit board using the resin composition and process for producing printed circuit board'1991 5,021,296'Circuit board and process for producing the same'1991 4,970,107'Composite article comprising a copper element and a process for producing it'1990 4,933,228'Thermosetting resin and prepreg and laminate using the same'1990 4,931,507'Composition comprising poly(p-hydroxystrene) derivative, epoxy-modified polybutadiene and aromatic maleimide'1990 4,886,858'Thermosetting resin and prepreg and laminate using the same'1989 4,784,917'Thermosetting resin composition and laminate and process for the production thereof'1988 4,738,900'Thermo-setting, polymerizable composition and wiring board'1988 4,708,427'Optical submarine cable connection'1987 4,607,094'Thermosetting resin composition from aromatic cyanamide'1986 4,587,162'Resin composition and laminate produced therefrom comprising a cyclized polybutadiene and a prepolymer of a isocyanuric or cyanuric acid derivative'1986

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1986–2010Patents assigned to HITACHI LTD (49)· patent assignee history

1986–2019Based in Hitachi, JP· patent location history

1991–2020Patents assigned to HITACHI CHEMICAL CO LTD (26)· patent assignee history

1997–2004Patents assigned to HONDA MOTOR CO LTD (7)· patent assignee history

1997–2006Based in Saitama, JP· patent location history

2001–2017Based in Tsukuba, JP· patent location history

2010–2020Patents assigned to MITSUI HIGH TEC (12)· patent assignee history

2010–2020Based in Kitakyushu, JP· patent location history

2011–2018Patents assigned to NAGAI AKIRA (17)· patent assignee history

2016–2019Based in Fukuoka, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
HITACHI LTD	49	1986–2010
HITACHI CHEMICAL CO LTD	26	1991–2020
NAGAI AKIRAself	17	2011–2018
MITSUI HIGH TEC	12	2010–2020
HONDA MOTOR CO LTD	7	1997–2004

Locations

Location	Patents	Span
Hitachi, JP	60	1986–2019
Tsukuba, JP	16	2001–2017
Kitakyushu, JP	10	2010–2020
Fukuoka, JP	6	2016–2019
Saitama, JP	6	1997–2006