Inventor

CHI-HAO HUANG

Inventor
TW

Overview

1→
Patents
2023
Patent span
Performing operations
Primary field (CPC B)

Patents· 1 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B24Bprimary
B24BMachines, devices, or processes for grinding or polishing33%
B24DTools for grinding, buffing or sharpening33%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1033%

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2023Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (1)· patent assignee history
2023Based in TW· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
TAIWAN SEMICONDUCTOR MFG CO LTD12023
Locations
LocationPatentsSpan
TW12023