Inventor
Sharon Ko Mei Wan
Inventor
Melaka, MY
Overview
Patents· 9 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1082%
H05KPrinted circuits9%
Y02PClimate change mitigation technologies in the production or processing of goods9%
PatentTitleYear
7,002,239'Leadless leadframe packaging panel featuring peripheral dummy leads'20066,963,124'Locking of mold compound to conductive substrate panels'20056,933,174'Leadless leadframe package design that provides a greater structural integrity'20056,818,970'Leadless leadframe package design that provides a greater structural integrity'20046,808,961'Locking of mold compound to conductive substrate panels'20046,777,788'Method and structure for applying thick solder layer onto die attach pad'20046,677,667'Leadless leadframe package design that provides a greater structural integrity'20046,576,989'Locking of mold compound to conductive substrate panels'20036,448,107'Pin indicator for leadless leadframe packages'2002Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2002–2006Patents assigned to NAT SEMICONDUCTOR CORP (9)· patent assignee history
2002–2006Based in Melaka, MY· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| NAT SEMICONDUCTOR CORP | 9 | 2002–2006 |
Locations
| Location | Patents | Span |
|---|---|---|
| Melaka, MY | 9 | 2002–2006 |