Inventor

Takeo Yasuho

Inventor

Neyagawa, JP

Overview

26→

Patents

1987–2009

Patent span

Electricity

Primary field (CPC H)

Patents· 26 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H05Kprimary

H05KPrinted circuits26%

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1022%

H01PWaveguides7%

H03KPulse technique7%

Y10TTechnical subjects covered by former us classification7%

H04BTransmission5%

G01RMeasuring electric variables3%

H03HImpedance networks, e.g. resonant circuits3%

Y02PClimate change mitigation technologies in the production or processing of goods3%

G02BOptical elements, systems or apparatus2%

PatentTitleYear

7,532,405'Micro lens, micro lens array, and method of manufacturing the same'2009 7,486,940'Digital broadcast receiving apparatus'2009 7,423,222'Circuit board and method of manufacturing the same'2008 7,423,418'Module part'2008 7,382,628'Circuit-component-containing module'2008 7,183,878'Surface acoustic wave filter'2007 7,180,012'Module part'2007 7,161,252'Module component'2007 7,161,371'Module part'2007 7,129,680'Voltage step-up and step-down DC/DC converter'2006 7,057,558'Antenna device'2006 6,995,630'High-frequency compound switch module and communication terminal using it'2006 6,933,802'High frequency switch'2005 6,917,258'High frequency switch'2005 6,880,244'Circuit board having simultaneously and unitarily formed wiring patterns and protrusions'2005 6,856,187'High frequency switch module'2005 6,846,375'Method of manufacturing multilayer ceramic wiring board and conductive paste for use'2005 6,831,528'High-frequency switching module and high-frequency apparatus equipped with the same'2004 6,544,818'Method of manufacturing semiconductor device'2003 6,372,158'Conductive paste'2002 6,303,989'Integrated circuit device on metal board with CPU power converter'2001 6,218,736'Circuit board and semiconductor device, and method of manufacturing the same'2001 5,528,458'Integrated circuit device and its manufacturing method'1996 5,490,041'Semiconductor integrated circuit module and a semiconductor integrated circuit device stacking the same'1996 5,346,402'Electronic circuit device and manufacturing method thereof'1994 4,670,633'Keyboard assembly with lighting'1987

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1987–2008Patents assigned to MATSUSHITA ELECTRIC INDUSTRIAL CO LTD (24)· patent assignee history

1987–2009Based in Neyagawa, JP· patent location history

2002–2009Based in Osaka, JP· patent location history

2009Patents assigned to PANASONIC CORP (2)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD	24	1987–2008
PANASONIC CORP	2	2009

Locations

Location	Patents	Span
Neyagawa, JP	16	1987–2009
Osaka, JP	10	2002–2009