Inventor
SHENG-FU HUANG
Inventor
TW
Overview
Patents· 9 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices38%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1038%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1014%
B01DSeparation5%
H10DInorganic electric semiconductor devices5%
PatentTitleYear
12,482,775Semiconductor structure202512,456,703Semiconductor device structure including a bonding structure202512,308,310Method for forming semiconductor interconnection structure against stress migration202511,742,242Method for manufacturing through-silicon via with liner202311,610,996Semiconductor structure and method of forming the same202311,387,207Method for fabricating semiconductor device including etching an edge portion of a bonding layer by using an etching mask202211,383,195Device for capturing particles202211,289,370Liner for through-silicon via202211,217,525Semiconductor structure and method of forming the same2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2025Patents assigned to NANYA TECHNOLOGY CORP (8)· patent assignee history
2022Patents assigned to IND TECH RES INST (1)· patent assignee history
2022–2025Based in TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| NANYA TECHNOLOGY CORP | 8 | 2022–2025 |
| IND TECH RES INST | 1 | 2022 |
Locations
| Location | Patents | Span |
|---|---|---|
| TW | 9 | 2022–2025 |