Inventor
HSIEN-JU TSOU
Inventor
TW
Overview
Patents· 9 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices31%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1031%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1031%
H10DInorganic electric semiconductor devices7%
PatentTitleYear
12,599,031Semiconductor package and method202612,148,733Shift control method in manufacture of semiconductor device202411,855,003Package structure and method of fabricating the same202311,456,245Silicon interposer including through-silicon via structures with enhanced overlay tolerance and methods of forming the same202211,296,032Silicon interposer including through-silicon via structures with enhanced overlay tolerance and methods of forming the same202211,205,615Semiconductor device and method of manufacture202111,183,482Shift control method in manufacture of semiconductor device202111,164,855Package structure with a heat dissipating element and method of manufacturing the same202111,139,285Semiconductor package2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021–2026Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (9)· patent assignee history
2021–2026Based in TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG CO LTD | 9 | 2021–2026 |
Locations
| Location | Patents | Span |
|---|---|---|
| TW | 9 | 2021–2026 |