Inventor
TSUNG-CHE TSAI
Inventor
US
Overview
Patents· 10 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices40%
H10DInorganic electric semiconductor devices28%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1020%
H02HEmergency protective circuit arrangements8%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h104%
PatentTitleYear
12,154,879Bump coplanarity for semiconductor device assembly and methods of manufacturing the same202412,068,308Integrated circuit structure with avalanche junction to doped semiconductor over semiconductor well202411,810,822Apparatuses and methods including patterns in scribe regions of semiconductor devices202311,791,626Electrostatic discharge clamp structures202311,769,767Diode triggered silicon controlled rectifier202311,742,309Bump coplanarity for semiconductor device assembly and methods of manufacturing the same202311,444,076Integrated circuit structure with avalanche junction to doped semiconductor over semiconductor well202211,335,674Diode triggered silicon controlled rectifier (SCR) with hybrid diodes202211,289,471Electrostatic discharge device202211,201,466Electrostatic discharge clamp structures2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021–2024Patents assigned to GLOBALFOUNDRIES US INC (7)· patent assignee history
2021–2024Based in US· patent location history
2023–2024Patents assigned to MICRON TECHNOLOGY INC (3)· patent assignee history
2023–2024Based in TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| GLOBALFOUNDRIES US INC | 7 | 2021–2024 |
| MICRON TECHNOLOGY INC | 3 | 2023–2024 |
Locations
| Location | Patents | Span |
|---|---|---|
| US | 7 | 2021–2024 |
| TW | 3 | 2023–2024 |