Inventor
Yugo Koyama
Inventor
Ina, JP
Overview
Patents· 14 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1038%
H03HImpedance networks, e.g. resonant circuits24%
H03BGeneration of oscillations, directly or by frequency-changing, by circuits employing active elements which operate in a non-switching manner10%
LOC137%
B81BMicrostructural devices or systems, e.g. micromechanical devices3%
F16HGearing3%
G01CMeasuring distances, levels or bearings3%
H01LSemiconductor devices3%
H10NElectric solid-state devices not otherwise provided for3%
Y10TTechnical subjects covered by former us classification3%
PatentTitleYear
8,841,762'Sensor module, sensor device, manufacturing method of sensor device, and electronic apparatus'20147,576,476'Piezoelectric device and method for manufacturing the same'20097,545,083'Piezoelectric device and method for manufacturing the same'20097,408,291'Piezoelectric oscillator, manufacturing method thereof, and electronic device'2008D0562273'Oscillator'20087,218,036'Piezoelectric oscillator, manufacturing method therefor, mobile phone apparatus using piezoelectric oscillator, and electronic apparatus using piezoelectric oscillator'2007D0532758'Oscillator'20067,123,107'Piezoelectric oscillator, manufacturing method thereof, and electronic device'20067,057,331'Piezoelectric oscillator, portable telephone unit using piezoelectric oscillator, and electronic equipment using piezoelectric oscillator'20066,998,926'Piezoelectric oscillator, portable phone employing piezoelectric oscillator, and electronic apparatus employing piezoelectric oscillator'20066,917,142'Piezoelectric oscillator, portable telephone using a piezoelectric oscillator, and electronic device using a piezoelectric oscillator'20056,689,679'Semiconductor device having bumps'20046,437,453'Wire bonding method, semiconductor device, circuit board, electronic instrument and wire bonding device'20026,323,552'Semiconductor device having bumps'2001Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2001–2014Patents assigned to SEIKO EPSON CORP (11)· patent assignee history
2001–2014Based in Ina, JP· patent location history
2004Based in Ima, JP· patent location history
2008–2009Patents assigned to EPSON TOYOCOM CORP (3)· patent assignee history
2014Patents assigned to KOYAMA YUGO (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SEIKO EPSON CORP | 11 | 2001–2014 |
| EPSON TOYOCOM CORP | 3 | 2008–2009 |
| KOYAMA YUGOself | 1 | 2014 |
Locations
| Location | Patents | Span |
|---|---|---|
| Ina, JP | 13 | 2001–2014 |
| Ima, JP | 1 | 2004 |