Inventor
Real Tetreault
Inventor
Granby, CA
Overview
Patents· 9 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1050%
G02BOptical elements, systems or apparatus21%
B29CShaping or joining of plastics14%
B29KIndexing scheme associated with subclasses b29b, b29c or b29d, relating to moulding materials or to materials for moulds, reinforcements, fillers or preformed parts, e.g. inserts7%
B29LIndexing scheme associated with subclass b29c, relating to particular articles7%
PatentTitleYear
6,988,882'Transfer molding of integrated circuit packages'20066,956,296'Transfer molding of integrated circuit packages'20056,822,875'Assembly of opto-electronic module with improved heat sink'20046,656,773'Transfer molding of integrated circuit packages'20036,547,452'Alignment systems for subassemblies of overmolded optoelectronic modules'20036,508,595'Assembly of opto-electronic module with improved heat sink'20036,309,575'Transfer molding method for forming integrated circuit package'20015,997,798'Biasing mold for integrated circuit chip assembly encapsulation'19995,939,778'Integrated circuit chip package'1999Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1999–2006Patents assigned to IBM (9)· patent assignee history
1999–2006Based in Granby, CA· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| IBM | 9 | 1999–2006 |
Locations
| Location | Patents | Span |
|---|---|---|
| Granby, CA | 9 | 1999–2006 |