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Inventor

Shih-Kuan Tai

Inventor
Hsinchu, TW

Overview

3→
Patents
2000–2002
Patent span
Electricity
Primary field (CPC H)

Patents· 3 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Pprimary
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1050%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1025%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests25%
PatentTitleYear
6,380,090'Protecting method applied to the semiconductor manufacturing process'20026,309,957'Method of low-K/copper dual damascene'20016,024,802'Vapor treatment process for reducing oxide depletion'2000

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2000Patents assigned to WINBOND ELECTRONICS CORP (1)· patent assignee history
2000Based in Hsin-Pu Zhen, TW· patent location history
2001Patents assigned to TAIWAN SEMICONDUCTOR MAUFACTUR (1)· patent assignee history
2001Based in Tai Po, CN· patent location history
2002Patents assigned to WINBOND ELECTRINICS CORP (1)· patent assignee history
2002Based in Hsinchu, TW· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
TAIWAN SEMICONDUCTOR MAUFACTUR12001
WINBOND ELECTRINICS CORP12002
WINBOND ELECTRONICS CORP12000
Locations
LocationPatentsSpan
Hsinchu, TW12002
Tai Po, CN12001
Hsin-Pu Zhen, TW12000