Inventor
Chanon Suwankasab
Inventor
Pathumthani, TH
Overview
Patents· 6 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices30%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1030%
H01GCapacitors10%
H05KPrinted circuits10%
B81BMicrostructural devices or systems, e.g. micromechanical devices5%
G01PMeasuring linear or angular speed, acceleration, deceleration, or shock5%
G01RMeasuring electric variables5%
H01RElectrically-conductive connections5%
PatentTitleYear
11,114,239Electronic device, device package, and method of fabrication202111,049,817Semiconductor device with integral EMI shield202110,790,220Press-fit semiconductor device202010,340,211Sensor module with blade insert20199,721,877'Method of mounting passive electronic component on lead frame'20179,257,374'Thin shrink outline package (TSOP)'2016Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2016–2021Patents assigned to NXP BV (5)· patent assignee history
2016–2021Based in Pathumthani, TH· patent location history
2017Patents assigned to Nexperia BV (1)· patent assignee history
2017Based in Bangkok, TH· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| NXP BV | 5 | 2016–2021 |
| Nexperia BV | 1 | 2017 |
Locations
| Location | Patents | Span |
|---|---|---|
| Pathumthani, TH | 5 | 2016–2021 |
| Bangkok, TH | 1 | 2017 |