Inventor
Akitsugu Hatazaki
Inventor
Yokkaichi, JP
Overview
Patents· 5 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1031%
H01LSemiconductor devices23%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1023%
H10DInorganic electric semiconductor devices15%
H10BElectronic memory devices8%
PatentTitleYear
10,825,770Semiconductor device having a stack body including metal films and first insulating films alternately stacked on a semiconductor substrate and including a stepped end portion and manufacturing method thereof202010,748,761Semiconductor manufacturing apparatus and method for manufacturing semiconductor device20208,878,364'Method for fabricating semiconductor device and semiconductor device'20147,095,124'Semiconductor device'20067,067,922'Semiconductor device'2006Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2006–2014Patents assigned to TOSHIBA KK (3)· patent assignee history
2006–2020Based in Yokkaichi, JP· patent location history
2014Based in Mie, JP· patent location history
2020Patents assigned to TOSHIBA MEMORY CORP (2)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TOSHIBA KK | 3 | 2006–2014 |
| TOSHIBA MEMORY CORP | 2 | 2020 |
Locations
| Location | Patents | Span |
|---|---|---|
| Yokkaichi, JP | 4 | 2006–2020 |
| Mie, JP | 1 | 2014 |