Inventor
Mostafa Naguib Abdulla
Inventor
Rancho Cordova, CA, US
Overview
Patents· 26 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1020%
G11CStatic stores18%
G06FElectric digital data processing15%
H01LSemiconductor devices14%
H04BTransmission9%
H10DInorganic electric semiconductor devices8%
H01QAntennas, i.e. radio aerials5%
H05KPrinted circuits5%
H03KPulse technique3%
H04LTransmission of digital information, e.g. telegraphic communication3%
PatentTitleYear
10,772,192Board-to-board contactless connectors and methods for the assembly thereof202010,727,833High-voltage and low-voltage data paths of a hybrid output driver202010,707,876High-voltage and low-voltage signaling output driver202010,666,263High-voltage and low-voltage signaling output driver202010,651,965Wireless serial links for communications between devices formed in a package202010,476,556Wireless communication link using near field coupling201910,403,586Signal isolation structures for EM communication201910,128,916Wireless communication link using near field coupling20189,887,169'Signal isolation structures for EM communication'20189,575,662'Multi-device memory serial architecture'20179,448,938'Cache coherence protocol for persistent memories'20169,401,745'Wireless communication link using near field coupling'20169,384,134'Persistent memory for processor main memory'20169,305,606'High-speed wireless serial communication link for a stacked device configuration using near field coupling'20169,075,725'Persistent memory for processor main memory'20158,996,822'Multi-device memory serial architecture'20158,860,496'Methods for receiving and transmitting voltage through the use of supply voltage or ground connections including bond pad interconnects for integrated circuit devices'20148,829,693'Supply voltage or ground connections for integrated circuit device'20148,694,737'Persistent memory for processor main memory'20148,582,356'Providing a ready-busy signal from a non-volatile memory device to a memory controller'20138,536,716'Supply voltage or ground connections for integrated circuit device'20138,531,849'Supply voltage or ground connections including bond pad interconnects for integrated circuit device'20138,331,857'Wireless interface to program phase-change memories'20128,289,767'Providing a ready-busy signal from a non-volatile memory device to a memory controller'20128,064,250'Providing a ready-busy signal from a non-volatile memory device to a memory controller'20117,535,689'Reducing input capacitance of high speed integrated circuits'2009Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2009–2020Based in Rancho Cordova, CA, US· patent location history
2011–2020Patents assigned to MICRON TECHNOLOGY INC (19)· patent assignee history
2011–2016Patents assigned to ABDULLA MOSTAFA NAGUIB (11)· patent assignee history
2013Patents assigned to ESKILDSEN STEVEN (2)· patent assignee history
2013Based in Cordova, CA, US· patent location history
2014–2016Patents assigned to CAMBER AUGUST (3)· patent assignee history
2018–2020Patents assigned to KEYSSA SYSTEMS INC (3)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| MICRON TECHNOLOGY INC | 19 | 2011–2020 |
| ABDULLA MOSTAFA NAGUIBself | 11 | 2011–2016 |
| CAMBER AUGUST | 3 | 2014–2016 |
| KEYSSA SYSTEMS INC | 3 | 2018–2020 |
| ESKILDSEN STEVEN | 2 | 2013 |
Locations
| Location | Patents | Span |
|---|---|---|
| Rancho Cordova, California, US | 25 | 2009–2020 |
| Cordova, California, US | 1 | 2013 |