Inventor
Masayuki Motonari
Inventor
Tokyo, JP
Overview
Patents· 21 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Pprimary
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1024%
C09GPolishing compositions18%
C09KMaterials for miscellaneous applications, not provided for elsewhere18%
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices7%
B24BMachines, devices, or processes for grinding or polishing6%
H01LSemiconductor devices6%
C08GMacromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds3%
C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients3%
C23FNon-mechanical removal of metallic material from surface3%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests3%
PatentTitleYear
10,090,163Inorganic film-forming composition for multilayer resist processes, and pattern-forming method20189,268,229'Composition for forming resist underlayer film, and pattern-forming method'20169,182,671'Method for forming pattern, and composition for forming resist underlayer film'20159,091,922'Resin composition, resist underlayer film, resist underlayer film-forming method and pattern-forming method'20158,927,201'Multilayer resist process pattern-forming method and multilayer resist process inorganic film-forming composition'20158,741,008'Aqueous dispersion for chemical mechanical polishing and chemical mechanical polishing method'20148,574,330'Chemical mechanical polishing aqueous dispersion and chemical mechanical polishing method for semiconductor device'20138,262,435'Chemical mechanical polishing aqueous dispersion, chemical mechanical polishing method, and chemical mechanical polishing aqueous dispersion preparation kit'20128,128,464'Chemical mechanical polishing pad'20127,183,211'Process for chemical mechanical polishing of semiconductor substrate and aqueous dispersion for chemical mechanical polishing'20077,153,369'Method of chemical mechanical polishing'20067,087,530'Aqueous dispersion for chemical mechanical polishing'20066,832,949'Window member for chemical mechanical polishing and polishing pad'20046,653,267'Aqueous dispersion for chemical mechanical polishing used for polishing of copper'20036,579,153'Aqueous dispersion for chemical mechanical polishing and chemical mechanical polishing process'20036,565,767'Polymer particles and polishing material containing them'20036,454,819'Composite particles and production process thereof, aqueous dispersion, aqueous dispersion composition for chemical mechanical polishing, and process for manufacture of semiconductor device'20026,447,695'Aqueous dispersion composition for chemical mechanical polishing for use in manufacture of semiconductor devices'20026,375,545'Chemical mechanical method of polishing wafer surfaces'20026,068,769'Aqueous dispersion slurry of inorganic particles and production methods thereof'20005,691,413'Ethylene-.alpha.-olefin-non-conjugated diene copolymer rubber composition'1997Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1997–2014Based in Yokkaichi, JP· patent location history
2000–2018Patents assigned to JSR CORP (19)· patent assignee history
2002–2006Patents assigned to TOSHIBA KK (5)· patent assignee history
2002–2018Based in Tokyo, JP· patent location history
2004Based in Mie, JP· patent location history
2006Based in Chuo-ku, JP· patent location history
2012–2014Patents assigned to MOTONARI MASAYUKI (4)· patent assignee history
2012–2014Patents assigned to KUNITANI EIICHIROU (2)· patent assignee history
2012–2014Patents assigned to UENO TOMIKAZU (2)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| JSR CORP | 19 | 2000–2018 |
| TOSHIBA KK | 5 | 2002–2006 |
| MOTONARI MASAYUKIself | 4 | 2012–2014 |
| KUNITANI EIICHIROU | 2 | 2012–2014 |
| UENO TOMIKAZU | 2 | 2012–2014 |
Locations
| Location | Patents | Span |
|---|---|---|
| Tokyo, JP | 13 | 2002–2018 |
| Yokkaichi, JP | 6 | 1997–2014 |
| Chuo-ku, JP | 1 | 2006 |
| Mie, JP | 1 | 2004 |