Inventor
HEUNGKYU KWON
Inventor
KR
Overview
Patents· 7 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices43%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1043%
H04WWireless communication networks7%
H05KPrinted circuits7%
PatentTitleYear
12,406,899Semiconductor package system202512,167,312Electronic device and operating method202411,908,758Semiconductor package including dual stiffener202411,908,810Hybrid semiconductor device and electronic device202411,658,090Semiconductor package system202311,600,607Semiconductor module including multiple power management semiconductor packages202311,244,885Semiconductor package system2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2025Patents assigned to SAMSUNG ELECTRONICS CO LTD (7)· patent assignee history
2022–2025Based in KR· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SAMSUNG ELECTRONICS CO LTD | 7 | 2022–2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| KR | 7 | 2022–2025 |