Inventor

Robert L. Bruce

Inventor
White Plains, NY, US

Overview

67→
Patents
1977–2021
Patent span
Electricity
Primary field (CPC H)

Patents· 67 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H01Lprimary
H01LSemiconductor devices21%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1012%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1012%
H10NElectric solid-state devices not otherwise provided for7%
H10BElectronic memory devices5%
A61BDiagnosis3%
G01NInvestigating or analysing materials by determining their chemical or physical properties3%
H10DInorganic electric semiconductor devices3%
B82BNanostructures formed by manipulation of individual atoms, molecules, or limited collections of atoms or molecules as discrete units2%
B01LChemical or physical laboratory apparatus for general use2%
PatentTitleYear
11,084,032Method to create multilayer microfluidic chips using spin-on carbon as gap fill and spin-on glass tone inversion202111,018,225III-V extension by high temperature plasma doping202110,991,763Vertical array of resistive switching devices having restricted filament regions and tunable top electrode volume202110,903,270Access device and phase change memory combination structure in backend of line (BEOL)202110,892,413Integration of confined phase change memory with threshold switching material202110,886,464Selective phase change material growth in high aspect ratio dielectric pores for semiconductor device fabrication202110,833,301Through silicon via energy storage devices202010,808,316Composition control of chemical vapor deposition nitrogen doped germanium antimony tellurium202010,770,656Method for manufacturing phase change memory202010,763,307Stackable cross-point phase-change material memory array with a resistive liner202010,727,121Thin film interconnects with large grains202010,727,114Interconnect structure including airgaps and substractively etched metal lines202010,718,758Biosensor for optical detection of nucleotide sequence202010,712,308Biosensor for electrical detection of a nucleotide sequence202010,707,417Single-sided liner PCM cell for 3D crossbar PCM memory202010,665,325Reduction of surface nucleotide hybridization by optimizing a biosensor sensing surface area202010,643,859Hydrofluorocarbon gas-assisted plasma etch for interconnect fabrication202010,593,729Vertical array of resistive switching devices having restricted filament regions and tunable top electrode volume202010,573,808Phase change memory with a dielectric bi-layer202010,433,789Method and apparatus for insertion of a sensor201910,393,642Pillar array structure with uniform and high aspect ratio nanometer gaps201910,376,213System, method and apparatus for sensor insertion201910,373,704Reduction of surface nucleotide hybridization by optimizing a biosensor sensing surface area201910,361,368Confined lateral switching cell for high density scaling201910,312,085Tone inversion integration for phase change memory201910,304,692Method of forming field effect transistor (FET) circuits, and forming integrated circuit (IC) chips with the FET circuits201910,276,384Plasma shallow doping and wet removal of depth control cap201910,236,252Hybrid subtractive etch/metal fill process for fabricating interconnects201910,217,661Articles including ultra low dielectric layers201910,211,054Tone inversion integration for phase change memory201910,170,361Thin film interconnects with large grains201910,167,443Wet clean process for removing C201910,141,503Selective phase change material growth in high aspect ratio dielectric pores for semiconductor device fabrication201810,128,185Hybrid subtractive etch/metal fill process for fabricating interconnects201810,121,676Interconnects fabricated by hydrofluorocarbon gas-assisted plasma etch20189,977,002Nanoporous structures by reactive ion etching20189,934,984Hydrofluorocarbon gas-assisted plasma etch for interconnect fabrication20189,868,119'Pillar array structure with uniform and high aspect ratio nanometer gaps'20189,773,698'Method of manufacturing an ultra low dielectric layer'20179,653,395'Hybrid subtractive etch/metal fill process for fabricating interconnects'20179,646,881'Hybrid subtractive etch/metal fill process for fabricating interconnects'20179,636,675'Pillar array structure with uniform and high aspect ratio nanometer gaps'20179,633,948'Low energy etch process for nitrogen-containing dielectric layer'20179,615,851'Method and apparatus for insertion of a sensor'20179,536,731'Wet clean process for removing CxHyFz etch residue'20179,424,596'Method and system for implementing a virtual game'20169,214,335'Surface plasma modification of porous thin-films to optimize pore filling'20159,190,316'Low energy etch process for nitrogen-containing dielectric layer'20159,117,652'Nanoporous structures by reactive ion etching'20159,054,160'Interconnect structure and method for fabricating on-chip interconnect structures by image reversal'20159,042,298'Method and apparatus for enabling internet-based emergency calls'20158,994,177'Far back end of the line stack encapsulation'20158,932,956'Far back end of the line stack encapsulation'20158,927,430'Overburden removal for pore fill integration approach'20158,845,530'Resposable biosensor assembly and method of sensing'20148,629,769'Method and system for communication between wireless devices'20148,597,117'Method and system for implementing a virtual game'20138,492,239'Homogeneous porous low dielectric constant materials'20138,483,792'Analyte sensor subassembly and methods and apparatuses for inserting an analyte sensor associated with same'20138,337,648'Ceramic joining'20128,079,955'Method and apparatus for managing glucose control'20117,280,602'Microwave signal edge detector circuit for improved clock recovery'20076,692,597'Ceramic joining'20044,430,636'Loop detector for traffic signal control'19844,171,907'Electro-optic distance measuring device'19794,039,951'Method and apparatus for digitally controlling an amplitude modulated pulse envelope on an RF signal'19774,011,562'Single frequency radio ranging system'1977

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1977–1984Based in San Diego, CA, US· patent location history
1984–2015Patents assigned to BRUCE ROBERT L (7)· patent assignee history
2004–2012Based in Arlington, VA, US· patent location history
2011–2019Patents assigned to BRUCE ROBERT (7)· patent assignee history
2011–2014Patents assigned to ISENSE CORP (4)· patent assignee history
2011–2019Based in Portland, OR, US· patent location history
2013–2021Patents assigned to IBM (47)· patent assignee history
2013–2021Based in White Plains, NY, US· patent location history
2013–2019Based in Beaverton, OR, US· patent location history
2015–2020Patents assigned to ZEON CORP (7)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
IBM472013–2021
BRUCE ROBERTself72011–2019
BRUCE ROBERT Lself71984–2015
ZEON CORP72015–2020
ISENSE CORP42011–2014
Locations
LocationPatentsSpan
White Plains, New York, US502013–2021
Portland, OR, US52011–2019
Beaverton, OR, US42013–2019
San Diego, California, US41977–1984
Arlington, Virginia, US22004–2012