Inventor
Masahiko Sekimoto
Inventor
Tokyo, JP
Overview
Patents· 39 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Pprimary
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1032%
B24BMachines, devices, or processes for grinding or polishing12%
C25DProcesses for the electrolytic or electrophoretic production of coatings12%
B41JTypewriters10%
C23CCoating metallic material10%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests9%
B23QDetails, components, or accessories for machine tools, e.g. arrangements for copying or controlling3%
H01LSemiconductor devices3%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h103%
Y10TTechnical subjects covered by former us classification3%
PatentTitleYear
10,639,912Ejection device202010,160,013Rinsing bath and substrate cleaning method using such rinsing bath201810,141,211Substrate processing apparatus and substrate transfer method20189,840,101'Droplet ejection apparatus'20179,786,532'Substrate processing apparatus and method of transferring a substrate'20179,186,915'Drying device and image forming apparatus'20159,126,435'Image forming apparatus'20158,777,198'Substrate holding apparatus, substrate holding method, and substrate processing apparatus'20148,225,803'Substrate processing method and apparatus'20128,141,513'Substrate holding apparatus, substrate holding method, and substrate processing apparatus'20128,133,376'Substrate holder, plating apparatus, and plating method'20128,109,595'Droplet ejection apparatus and cleaning method of a droplet receiving surface'20128,066,365'Image forming apparatus and image forming method'20118,048,282'Apparatus and method for plating a substrate'20117,976,362'Substrate polishing apparatus and method'20117,959,977'Substrate processing method and apparatus'20117,886,685'Substrate holding apparatus, substrate holding method, and substrate processing apparatus'20117,810,897'Droplet ejection apparatus and cleaning method of a droplet receiving surface'20107,807,027'Substrate holder, plating apparatus, and plating method'20107,735,450'Substrate holding apparatus'20107,735,451'Substrate processing method and apparatus'20107,699,434'Liquid droplet discharging device'20107,669,959'Droplet ejection device'20107,632,378'Polishing apparatus'20097,585,205'Substrate polishing apparatus and method'20097,575,636'Substrate processing apparatus and substrate processing method'20097,442,257'Substrate processing apparatus and substrate processing method'20087,368,016'Substrate processing unit and substrate processing apparatus'20087,341,634'Apparatus for and method of processing substrate'20087,087,117'Substrate processing apparatus and substrate processing method'20067,063,600'Polishing apparatus'20066,929,529'Polishing apparatus'20056,878,044'Polishing apparatus'20056,844,274'Substrate holder, plating apparatus, and plating method'20056,682,408'Polishing apparatus'20046,629,883'Polishing apparatus'20036,358,128'Polishing apparatus'20026,354,922'Polishing apparatus'20026,293,855'Polishing apparatus'2001Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2001–2018Patents assigned to EBARA CORP (30)· patent assignee history
2001–2018Based in Tokyo, JP· patent location history
2003Based in Zushi, JP· patent location history
2010–2020Patents assigned to FUJI XEROX CO LTD (9)· patent assignee history
2010–2017Based in Kanagawa, JP· patent location history
2011–2014Patents assigned to SEKIMOTO MASAHIKO (6)· patent assignee history
2012–2014Patents assigned to KATSUOKA SEIJI (4)· patent assignee history
2012–2014Patents assigned to KOBAYASHI KENICHI (3)· patent assignee history
2012–2020Based in Ebina, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| EBARA CORP | 30 | 2001–2018 |
| FUJI XEROX CO LTD | 9 | 2010–2020 |
| SEKIMOTO MASAHIKOself | 6 | 2011–2014 |
| KATSUOKA SEIJI | 4 | 2012–2014 |
| KOBAYASHI KENICHI | 3 | 2012–2014 |
Locations
| Location | Patents | Span |
|---|---|---|
| Tokyo, JP | 29 | 2001–2018 |
| Kanagawa, JP | 7 | 2010–2017 |
| Ebina, JP | 2 | 2012–2020 |
| Zushi, JP | 1 | 2003 |