Inventor
Gerd Schlottig
Inventor
Uitikon Waldegg, CH
Overview
Patents· 24 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices27%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1027%
H05KPrinted circuits15%
F28FDetails of heat-exchange and heat-transfer apparatus, of general application11%
F16LPipes7%
Y10TTechnical subjects covered by former us classification7%
F28DHeat-exchange apparatus, not provided for in another subclass, in which the heat-exchange media do not come into direct contact2%
G02BOptical elements, systems or apparatus2%
G06FElectric digital data processing2%
PatentTitleYear
10,886,254Flip-chip electronic device with carrier having heat dissipation elements free of solder mask202110,767,939Disconnect assembly for active cooling of packaged electronics202010,763,189Sealing arrangement202010,727,158Counter-flow expanding channels for enhanced two-phase heat removal202010,727,159Counter-flow expanding channels for enhanced two-phase heat removal202010,551,132Heat removal element with thermal expansion coefficient mismatch202010,529,648Counter-flow expanding channels for enhanced two-phase heat removal202010,527,365Disconnect assembly for active cooling of packaged electronics202010,388,540High-performance compliant heat-exchanger comprising vapor chamber201910,157,814Compliant heat sink201810,153,250Flip-chip electronic device with carrier having heat dissipation elements free of solder mask201810,132,433Releasable, threadless conduit connector for liquid manifold201810,107,426Releasable, threadless conduit connector for liquid manifold201810,006,571Releasable, threadless conduit connector for liquid manifold20189,941,189Counter-flow expanding channels for enhanced two-phase heat removal20189,880,595'Cooling device with nested chambers for computer hardware'20189,864,152'Optical assembly with optical coupler'20189,698,089'Substrate device and electric circuit arrangement having first substrate section perpendicular to second substrate section'20179,433,077'Substrate device and electric circuit arrangement having first substrate section perpendicular to second substrate section'20169,397,042'Integrated helical multi-layer inductor structures'20169,230,832'Method for manufacturing a filled cavity between a first and a second surface'20169,066,460'Disassemblable electronic assembly with leak-inhibiting coolant capillaries'20158,937,810'Electronic assembly with detachable coolant manifold and coolant-cooled electronic module'20158,907,503'Manufacturing an underfill in a semiconductor chip package'2014Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2014–2021Patents assigned to IBM (24)· patent assignee history
2014–2018Based in Rueschlikon, CH· patent location history
2015Patents assigned to BRUNSCHWILER THOMAS J (1)· patent assignee history
2015Patents assigned to COLGAN EVAN G (1)· patent assignee history
2015Patents assigned to ELLSWORTH JR MICHAEL J (1)· patent assignee history
2015Patents assigned to ESCHER WERNER (1)· patent assignee history
2015Based in Zurich, CH· patent location history
2016–2021Based in Uitikon Waldegg, CH· patent location history
2016–2020Based in Uitikon, CH· patent location history
2016–2018Based in Waldegg, CH· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| IBM | 24 | 2014–2021 |
| BRUNSCHWILER THOMAS J | 1 | 2015 |
| COLGAN EVAN G | 1 | 2015 |
| ELLSWORTH JR MICHAEL J | 1 | 2015 |
| ESCHER WERNER | 1 | 2015 |
Locations
| Location | Patents | Span |
|---|---|---|
| Uitikon Waldegg, CH | 11 | 2016–2021 |
| Uitikon, CH | 7 | 2016–2020 |
| Waldegg, CH | 2 | 2016–2018 |
| Rueschlikon, CH | 2 | 2014–2018 |
| Zurich, CH | 2 | 2015 |