Inventor
Jun Sonobe
Inventor
Tsukuba, JP
Overview
Patents· 6 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
C23Cprimary
C23CCoating metallic material27%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1027%
H01LSemiconductor devices20%
B01DSeparation7%
B08BCleaning in general7%
C23FNon-mechanical removal of metallic material from surface7%
F17CVessels for containing or storing compressed, liquefied or solidified gases7%
PatentTitleYear
9,683,288'Method of manufacturing semiconductor device and method of cleaning processing vessel'20179,540,727'Cleaning method, method of manufacturing semiconductor device, substrate processing apparatus and recording medium'20179,012,331'Etching method and non-transitory storage medium'20158,679,259'Substrate processing apparatus, method of manufacturing semiconductor device and method of cleaning processing vessel'20148,119,853'Low pressure acetylene storage'20127,942,974'Method of cleaning a film-forming apparatus'2011Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2011–2017Patents assigned to AIR LIQUIDE (5)· patent assignee history
2011–2017Based in Tsukuba, JP· patent location history
2012–2014Patents assigned to SONOBE JUN (2)· patent assignee history
2012Patents assigned to HUANG SHIH-WEN (1)· patent assignee history
2014–2017Patents assigned to HITACHI INT ELECTRIC INC (3)· patent assignee history
2014Patents assigned to KAMEDA KENJI (1)· patent assignee history
2014Based in Ibaraki, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| AIR LIQUIDE | 5 | 2011–2017 |
| HITACHI INT ELECTRIC INC | 3 | 2014–2017 |
| SONOBE JUNself | 2 | 2012–2014 |
| HUANG SHIH-WEN | 1 | 2012 |
| KAMEDA KENJI | 1 | 2014 |
Locations
| Location | Patents | Span |
|---|---|---|
| Tsukuba, JP | 5 | 2011–2017 |
| Ibaraki, JP | 1 | 2014 |