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Inventor

Jamil A. Wakil

Inventor
Wappingers Falls, NY, US

Overview

14→
Patents
2003–2018
Patent span
Electricity
Primary field (CPC H)

Patents· 14 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1050%
Y10TTechnical subjects covered by former us classification23%
B23PMetal-working not otherwise provided for8%
F28FDetails of heat-exchange and heat-transfer apparatus, of general application4%
G01KMeasuring temperature4%
G01RMeasuring electric variables4%
H01LSemiconductor devices4%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h104%
PatentTitleYear
9,943,936Overmolded dual in-line memory module cooling structure20188,900,503'Method of forming an overmolded dual in-line memory module cooling structure'20148,299,608'Enhanced thermal management of 3-D stacked die packaging'20128,037,594'Method of forming a flip-chip package'20117,982,475'Structure and method for reliability evaluation of FCPBGA substrates for high power semiconductor packaging applications'20117,928,562'Segmentation of a die stack for 3D packaging thermal management'20117,698,114'Techniques for distributing power in electronic circuits and computer systems'20107,489,512'Optimized thermally conductive plate and attachment method for enhanced thermal performance and reliability of flip chip organic packages'20097,319,591'Optimized thermally conductive plate and attachment method for enhanced thermal performance and reliability of flip chip organic packages'20087,167,806'Method and system for measuring temperature and power distribution of a device'20076,829,144'Flip chip package with heat spreader allowing multiple heat sink attachment'20046,793,123'Packaging for multi-processor shared-memory system'20046,622,786'Heat sink structure with pyramidic and base-plate cut-outs'20036,541,847'Packaging for multi-processor shared-memory system'2003

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2003–2014Patents assigned to IBM (13)· patent assignee history
2003–2004Based in Binghamton, NY, US· patent location history
2004–2011Based in Wappingers Falls, NY, US· patent location history
2010–2011Based in Buchanan Dam, TX, US· patent location history
2011–2018Based in Austin, TX, US· patent location history
2012–2014Patents assigned to WAKIL JAMIL A (2)· patent assignee history
2012Patents assigned to BARTLEY GERALD K (1)· patent assignee history
2014Patents assigned to BORAAS MICHAEL A (1)· patent assignee history
2014Patents assigned to KAMATH VINOD (1)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
IBM132003–2014
WAKIL JAMIL Aself22012–2014
BARTLEY GERALD K12012
BORAAS MICHAEL A12014
KAMATH VINOD12014
Locations
LocationPatentsSpan
Wappingers Falls, New York, US52004–2011
Austin, Texas, US42011–2018
Binghamton, New York, US32003–2004
Buchanan Dam, Texas, US22010–2011