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Inventor

Yan Huo

Inventor
Shanghai, CN

Overview

20→
Patents
2010–2019
Patent span
Electricity
Primary field (CPC H)

Patents· 20 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1026%
H01LSemiconductor devices23%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1017%
H04NPictorial communication, e.g. television13%
G06TImage data processing or generation, in general6%
H10DInorganic electric semiconductor devices6%
G06FElectric digital data processing2%
G06KGraphical data reading2%
G06VImage or video recognition or understanding2%
H04BTransmission2%
PatentTitleYear
10,504,823Power semiconductor device with small contact footprint and the preparation method201910,043,736Hybrid packaged lead frame based multi-chip semiconductor device with multiple interconnecting structures20189,653,383'Semiconductor device with thick bottom metal and preparation method thereof'20179,646,920'Power semiconductor device with small contact footprint and the preparation method'20179,425,181'Method of hybrid packaging a lead frame based multi-chip semiconductor device with multiple interconnecting structures'20169,337,131'Power semiconductor device and the preparation method'20169,337,127'Ultra-thin semiconductor device and preparation method thereof'20169,245,831'Top-exposed semiconductor package and the manufacturing method'20169,117,809'Ultra-thin semiconductor device and preparation method thereof'20159,087,828'Semiconductor device with thick bottom metal and preparation method thereof'20159,087,378'Scale changing detection and scaling ratio determination by using motion information'20159,054,091'Hybrid packaged lead frame based multi-chip semiconductor device with multiple semiconductor chips and multiple interconnecting structures'20158,703,545'Aluminum alloy lead-frame and its use in fabrication of power semiconductor package'20148,498,330'Method and apparatus for coding mode selection'20138,326,050'Method and apparatus for subpixel-based down-sampling'20128,259,819'Method and apparatus for improving video quality by utilizing a unified loop filter'20128,228,983'Method and device for order-16 integer transform from order-8 integer cosine transform'20128,165,211'Method and apparatus of de-interlacing video'20128,090,031'Method for motion compensation'20127,706,440'Method for reducing bit rate requirements for encoding multimedia data'2010

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2010–2015Patents assigned to HK APPLIED SCIENCE & TECH RES (8)· patent assignee history
2010–2012Based in Hong Kong, CN· patent location history
2012–2015Patents assigned to HUO YAN (10)· patent assignee history
2012–2015Based in Shenzhen, CN· patent location history
2014–2018Patents assigned to ALPHA & OMEGA SEMICONDUCTOR (8)· patent assignee history
2014–2015Patents assigned to LU JUN (3)· patent assignee history
2014Based in Songjiang, CN· patent location history
2015–2019Patents assigned to ALPHA & OMEGA SEMICONDUCTOR CAYMAN LTD (3)· patent assignee history
2015–2019Based in Shanghai, CN· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
HUO YANself102012–2015
ALPHA & OMEGA SEMICONDUCTOR82014–2018
HK APPLIED SCIENCE & TECH RES82010–2015
ALPHA & OMEGA SEMICONDUCTOR CAYMAN LTD32015–2019
LU JUN32014–2015
Locations
LocationPatentsSpan
Shanghai, CN112015–2019
Shenzhen, CN52012–2015
Hong Kong, CN32010–2012
Songjiang, CN12014