Inventor
Gerald Weidinger
Inventor
Leoben, AT
Overview
Patents· 15 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H05Kprimary
H05KPrinted circuits26%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1018%
H01LSemiconductor devices16%
Y10TTechnical subjects covered by former us classification9%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h105%
F21VFunctional features or details of lighting devices or systems thereof4%
F28DHeat-exchange apparatus, not provided for in another subclass, in which the heat-exchange media do not come into direct contact4%
F28FDetails of heat-exchange and heat-transfer apparatus, of general application4%
Y02EReduction of greenhouse gas [ghg] emissions, related to energy generation, transmission or distribution4%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form2%
PatentTitleYear
11,049,778Component carrier with a stepped cavity and a stepped component assembly embedded within the stepped cavity202110,993,313Non-uniform magnetic foil embedded in component carrier202110,867,888Component carrier comprising at least one heat pipe and method for producing said component carrier202010,861,636Inductor made of component carrier material comprising electrically conductive plate structures202010,709,023Placement of component in circuit board intermediate product by flowable adhesive layer on carrier substrate202010,665,526Component carrier comprising at least one heat pipe and method for producing said component carrier202010,455,703Method for producing a printed circuit board with an embedded sensor chip, and printed circuit board201910,306,750Circuit board and method for manufacturing a circuit board201910,187,997Method for making contact with a component embedded in a printed circuit board201910,051,747Method for the production of a circuit board involving the removal of a subregion thereof20189,967,972Circuit board having an asymmetric layer structure20189,253,888'Method for integrating an electronic component into a printed circuit board or a printed circuit board intermediate product, and printed circuit board or printed circuit board intermediate product'20168,685,196'Method for producing a multilayer printed circuit board, adhesion prevention material and multilayer printed circuit board and use of such a method'20148,541,689'Method for removing a part of a planar material layer and multilayer structure'20138,388,792'Nonstick material, method for removing a part of a planar material layer and multilayer structure and use therefor'2013Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2013–2021Patents assigned to AUSTRIA TECH & SYSTEM TECH (8)· patent assignee history
2013–2016Patents assigned to STAHR JOHANNES (4)· patent assignee history
2013–2016Patents assigned to WEIDINGER GERALD (4)· patent assignee history
2013–2014Patents assigned to LEITGEB MARKUS (3)· patent assignee history
2013Based in Vienna, AT· patent location history
2014–2021Based in Leoben, AT· patent location history
2018–2021Patents assigned to AT & S AUSTRIA TECH & SYSTEMTECHNIK AG (9)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| AT & S AUSTRIA TECH & SYSTEMTECHNIK AG | 9 | 2018–2021 |
| AUSTRIA TECH & SYSTEM TECH | 8 | 2013–2021 |
| STAHR JOHANNES | 4 | 2013–2016 |
| WEIDINGER GERALDself | 4 | 2013–2016 |
| LEITGEB MARKUS | 3 | 2013–2014 |
Locations
| Location | Patents | Span |
|---|---|---|
| Leoben, AT | 13 | 2014–2021 |
| Vienna, AT | 2 | 2013 |