Inventor

David L. Remerowski

Inventor
Cincinnati, OH, US

Overview

22→
Patents
1996–2005
Patent span
Performing operations
Primary field (CPC B)

Patents· 22 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B29Cprimary
B29CShaping or joining of plastics20%
B25CHand-held nailing or stapling tools14%
C09JAdhesives14%
B29KIndexing scheme associated with subclasses b29b, b29c or b29d, relating to moulding materials or to materials for moulds, reinforcements, fillers or preformed parts, e.g. inserts10%
F16BDevices for fastening or securing constructional elements or machine parts together, e.g. nails, bolts, circlips, clamps, clips or wedges8%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests8%
B23KSoldering or unsoldering6%
Y10TTechnical subjects covered by former us classification6%
C06BExplosives or thermic compositions4%
B29LIndexing scheme associated with subclass b29c, relating to particular articles2%

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1996–1998Patents assigned to SENCORP (4)· patent assignee history
1996–2005Based in Cincinnati, OH, US· patent location history
1998–2005Patents assigned to SENCO PRODUCTS (17)· patent assignee history
2003Patents assigned to REMEROWSKI DAVID L (1)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
SENCO PRODUCTS171998–2005
SENCORP41996–1998
REMEROWSKI DAVID Lself12003
Locations
LocationPatentsSpan
Cincinnati, OH, US221996–2005