Inventor

Tong-Hong Wang

Inventor

Selangor, MY

Overview

5→

Patents

2007–2020

Patent span

Performing operations

Primary field (CPC B)

Patents· 5 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1044%

B29CShaping or joining of plastics11%

B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form11%

B62DMotor vehicles11%

B65DContainers for storage or transport of articles or materials, e.g. bags, barrels, bottles, boxes, cans, cartons, crates, drums, jars, tanks, hoppers, forwarding containers11%

E04CStructural elements11%

PatentTitleYear

10,780,678Composite sandwich structure2020 8,022,534'Semiconductor package using an active type heat-spreading element'2011 7,482,204'Chip packaging process'2009 7,335,982'Chip package structure and chip packaging process'2008 7,259,456'Heat dissipation apparatus for package device'2007

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2007–2011Patents assigned to ADVANCED SEMICONDUCTOR ENG (4)· patent assignee history

2007–2011Based in Selangor, MY· patent location history

2020Patents assigned to FERGUSSONS ADVANCED COMPOSITE TECH LIMITED (1)· patent assignee history

2020Based in London, GB· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
ADVANCED SEMICONDUCTOR ENG	4	2007–2011
FERGUSSONS ADVANCED COMPOSITE TECH LIMITED	1	2020

Locations

Location	Patents	Span
Selangor, MY	4	2007–2011
London, GB	1	2020