LexDanaLexDanabeta
Inventor

Kenji Kubota

Inventor
Naka, JP

Overview

45→
Patents
1987–2021
Patent span
Electricity
Primary field (CPC H)

Patents· 45 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

Y10Tprimary
Y10TTechnical subjects covered by former us classification12%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1010%
H05KPrinted circuits7%
C25DProcesses for the electrolytic or electrophoretic production of coatings6%
H01RElectrically-conductive connections6%
H01GCapacitors6%
H04NPictorial communication, e.g. television6%
H01QAntennas, i.e. radio aerials5%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h105%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form3%
PatentTitleYear
10,910,130Corrosion-resistant terminal material, corrosion-resistant terminal, and wire-end structure202110,858,750Tin-plated copper terminal material, terminal and electric wire terminal-end structure202010,801,115Tinned copper terminal material, terminal, and electrical wire end part structure202010,793,956Additive for high-purity copper electrolytic refining and method of producing high-purity copper202010,428,434Additive for high-purity copper electrolytic refining, method of producing high-purity copper, and high-purity electrolytic copper201910,407,785Additive for high-purity copper electrolytic refining and method of producing high-purity copper201910,358,730Additive for high-purity copper electrolytic refining and method of producing high-purity copper201910,301,737Method of manufacturing tin-plated copper terminal material201910,280,347Semiconductor device manufacturing method and underfill film201910,021,787Resin substrate combined structure20189,616,639'Tin-plated copper-alloy material for terminal having excellent insertion/extraction performance'20179,460,550'Multi-viewpoint image generation apparatus and method'20168,981,233'Conductive member and method for producing the same'20158,976,171'Depth estimation data generating apparatus, depth estimation data generating method, and depth estimation data generating program, and pseudo three-dimensional image generating apparatus, pseudo three-dimensional image generating method, and pseudo three-dimensional image generating program'20158,940,404'Tin-plated copper-alloy material for terminal and method for producing the same'20158,698,002'Conductive member and method for producing the same'20148,381,997'Radio frequency IC device and method of manufacturing the same'20138,363,166'Image quality improving device and method'20138,339,518'Video signal processing method and apparatus using histogram'20128,063,861'Image display unit'20118,027,120'Magnetic tape device and data recording method'20117,782,403'Noise detection apparatus and method, and noise reduction apparatus and method'20107,400,321'Image display unit'20086,871,388'Method of forming an electronic component located on a surface of a package member with a space therebetween'20056,861,588'Laminated ceramic electronic component and method of producing the same'20056,507,139'Apparatus having an electronic component located on a surface of a package member with a space therebetween'20036,277,209'Method and apparatus of regenerating filtration membrane cartridge for activated sludge'20016,018,322'Earth structure for antennas, and antenna apparatus with earth for vehicles'20006,008,767'Glass antenna having a shape to provide maximum reception sensitivity while not blocking a driver\'s sight'19996,002,373'Glass window antenna'19995,952,977'Glass antenna'19995,793,333'Glass antenna for vehicles, and designing method of the same'19985,659,324'Glass antenna and method of designing the same'19975,644,107'Method of manufacturing a multilayer electronic component'19975,635,669'Multilayer electronic component'19975,635,670'Multilayer electronic component'19975,625,935'Method of manufacturing a multilayer electronic component'19975,604,328'Multilayer electronic component'19975,493,769'Method of manufacturing electronic component and measuring characteristics of same'19965,488,765'Method of measuring characteristics of a multilayer electronic component'19965,335,327'External memory control techniques with multiprocessors improving the throughput of data between a hierarchically upper processing unit and an external memory with efficient use of a cache memory'19945,241,640'Disk unit with processors which detect cache status and control port selection for optimizing utilization of cache interfacing host and external memory'19934,774,755'Magnetic head and process for producing same'19884,719,527'Composite magnetic head having accurately aligned gaps'19884,641,249'Method and device for compensating temperature-dependent characteristic changes in ion-sensitive FET transducer'1987

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1996–2018Patents assigned to MURATA MANUFACTURING CO (12)· patent assignee history
1996–1997Based in Kyoto, JP· patent location history
1997–2000Patents assigned to MAZDA MOTOR (6)· patent assignee history
1997–2000Based in Kure, JP· patent location history
1997–2018Based in Nagaokakyo, JP· patent location history
2008–2015Based in Yokohama, JP· patent location history
2011–2017Patents assigned to KUBOTA KENJI (7)· patent assignee history
2012–2016Patents assigned to JVC KENWOOD CORP (4)· patent assignee history
2015–2021Patents assigned to MITSUBISHI MATERIALS CORP (9)· patent assignee history
2015–2021Based in Naka, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
MURATA MANUFACTURING CO121996–2018
MITSUBISHI MATERIALS CORP92015–2021
KUBOTA KENJIself72011–2017
MAZDA MOTOR61997–2000
JVC KENWOOD CORP42012–2016
Locations
LocationPatentsSpan
Naka, JP102015–2021
Kyoto, JP61996–1997
Yokohama, JP52008–2015
Kure, JP51997–2000
Nagaokakyo, JP31997–2018