Inventor
Masayuki Hosoda
Inventor
Asaka, JP
Overview
Patents· 6 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H03Fprimary
H03FAmplifiers18%
A61BDiagnosis9%
G01HMeasurement of mechanical vibrations or ultrasonic, sonic or infrasonic waves9%
G01PMeasuring linear or angular speed, acceleration, deceleration, or shock9%
G11BInformation storage based on relative movement between record carrier and transducer9%
H01LSemiconductor devices9%
H03GControl of amplification9%
H04BTransmission9%
H04RLoudspeakers, microphones, gramophone pick-ups or like acoustic electromechanical transducers9%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h109%
PatentTitleYear
11,075,606Power amplifier circuit and antenna device202110,270,406Power amplifier, semiconductor integrated circuit, and method of controlling the power amplifier20199,681,235'Vibration detection component, and acoustic device and information apparatus using vibration detection component'20177,222,536'Semiconductor acceleration sensor'20075,569,268'Endoscopic instrument for ligating varix'19965,499,153'Floating magnetic head device and its securing method'1996Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1996–2007Patents assigned to HITACHI METALS LTD (2)· patent assignee history
1996Patents assigned to TOP KK (1)· patent assignee history
1996Based in Tokyo, JP· patent location history
2007Based in Mohka, JP· patent location history
2017–2021Patents assigned to FUJITSU LTD (3)· patent assignee history
2017Based in Isehara, JP· patent location history
2019Based in Yamato, JP· patent location history
2021Based in Asaka, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| FUJITSU LTD | 3 | 2017–2021 |
| HITACHI METALS LTD | 2 | 1996–2007 |
| TOP KK | 1 | 1996 |
Locations
| Location | Patents | Span |
|---|---|---|
| Asaka, JP | 1 | 2021 |
| Yamato, JP | 1 | 2019 |
| Isehara, JP | 1 | 2017 |
| Mohka, JP | 1 | 2007 |
| Tokyo, JP | 1 | 1996 |