Inventor
Kenta Chito
Inventor
Tokyo, JP
Overview
Patents· 7 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices32%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1032%
H01JElectric discharge tubes or discharge lamps14%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1014%
B23KSoldering or unsoldering9%
PatentTitleYear
10,957,593Method of processing a wafer202110,910,246Hold checking method and unhold checking method for wafer202110,896,836Electrostatic chuck202110,790,192Wafer processing method202010,790,193Wafer processing method202010,665,492Wafer unloading method202010,453,719Plasma etching method2019Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2019–2021Patents assigned to DISCO CORP (7)· patent assignee history
2019–2021Based in Tokyo, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| DISCO CORP | 7 | 2019–2021 |
Locations
| Location | Patents | Span |
|---|---|---|
| Tokyo, JP | 7 | 2019–2021 |