Inventor
Tang-Jung Chiu
Inventor
Hsinchu, TW
Overview
Patents· 6 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1028%
H01LSemiconductor devices22%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1022%
G01RMeasuring electric variables11%
H10DInorganic electric semiconductor devices11%
G01BMeasuring length, thickness or similar linear dimensions6%
PatentTitleYear
11,018,065Semiconductor device structure with magnetic element in testing region202110,634,717Testing apparatus and testing method20209,859,176'Semiconductor device, test system and method of the same'20189,653,427'Integrated circuit package with probe pad structure'20179,281,254'Methods of forming integrated circuit package'20168,604,549'Multi-gate field-effect transistor with enhanced and adaptable low-frequency noise'2013Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2013Patents assigned to CHEN HSIN (1)· patent assignee history
2013Patents assigned to CHIU TANG-JUNG (1)· patent assignee history
2013Patents assigned to GONG JENG (1)· patent assignee history
2013Patents assigned to NAT UNIV TSING HUA (1)· patent assignee history
2013–2021Based in Hsinchu, TW· patent location history
2017–2021Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (4)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG CO LTD | 4 | 2017–2021 |
| CHEN HSIN | 1 | 2013 |
| CHIU TANG-JUNGself | 1 | 2013 |
| GONG JENG | 1 | 2013 |
| NAT UNIV TSING HUA | 1 | 2013 |
Locations
| Location | Patents | Span |
|---|---|---|
| Hsinchu, TW | 6 | 2013–2021 |