Inventor
YU-JUNG CHANG
Inventor
TW
Overview
Patents· 20 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
G06Fprimary
G06FElectric digital data processing24%
H01LSemiconductor devices22%
H10DInorganic electric semiconductor devices21%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1012%
H03KPulse technique5%
A61BDiagnosis3%
H04RLoudspeakers, microphones, gramophone pick-ups or like acoustic electromechanical transducers3%
B23QDetails, components, or accessories for machine tools, e.g. arrangements for copying or controlling2%
F16DCouplings for transmitting rotation2%
H02NElectric machines not otherwise provided for2%
PatentTitleYear
12,396,681Wearable device202512,393,761Integrated circuit and method of forming the same202512,353,815Method for chip integration202512,341,103Integrated circuit and method of manufacturing same202512,265,774Boundary cell202512,236,180Integrated circuit and method of manufacturing the same202512,199,087Dummy poly layout for high density devices202512,165,969Integrated circuit device and method202412,125,850Buried metal track and methods forming same202412,073,166Method and structure for mandrel patterning202411,881,477Dummy poly layout for high density devices202411,868,699Inverted integrated circuit and method of forming the same202411,775,724Integrated circuit and method of manufacturing the same202311,709,986Boundary cell202311,708,876Pushing force-actuated braking device and rotary table using the same202311,550,986Inverted integrated circuit and method of forming the same202311,523,208Eartip and a wearable device including an eartip202211,508,661Integrated circuit and method of manufacturing same202211,183,951Flexure stage with modularized flexure units202111,138,361Integrated circuit and system of manufacturing the same2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021–2025Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (16)· patent assignee history
2021Patents assigned to HIWIN MIKROSYSTEM CORP (1)· patent assignee history
2021Patents assigned to HIWIN MTKROSYSTEM CORP (1)· patent assignee history
2021–2025Based in TW· patent location history
2022–2025Patents assigned to ADVANCED SEMICONDUCTOR ENG (2)· patent assignee history
2023Patents assigned to HIWIN TECH CORP (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG CO LTD | 16 | 2021–2025 |
| ADVANCED SEMICONDUCTOR ENG | 2 | 2022–2025 |
| HIWIN MIKROSYSTEM CORP | 1 | 2021 |
| HIWIN MTKROSYSTEM CORP | 1 | 2021 |
| HIWIN TECH CORP | 1 | 2023 |
Locations
| Location | Patents | Span |
|---|---|---|
| TW | 20 | 2021–2025 |