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Inventor

Yan-Fu Lin

Inventor
Zhubei City, TW

Overview

7→
Patents
2014–2019
Patent span
Electricity
Primary field (CPC H)

Patents· 7 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1050%
H01LSemiconductor devices43%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h107%
PatentTitleYear
10,510,674Fan-out package having a main die and a dummy die, and method of forming201910,163,802Fan-out package having a main die and a dummy die, and method of forming20189,852,957Testing, manufacturing, and packaging methods for semiconductor devices20179,812,426'Integrated fan-out package, semiconductor device, and method of fabricating the same'20179,093,314'Copper bump structures having sidewall protection layers'20158,922,004'Copper bump structures having sidewall protection layers'20148,629,568'Semiconductor device cover mark'2014

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2014–2015Patents assigned to TAIWAN SEMICONDUCTOR MFG (3)· patent assignee history
2014Patents assigned to CHIOU WEN-CHIH (2)· patent assignee history
2014Patents assigned to LIN JING-CHENG (2)· patent assignee history
2014Patents assigned to Lin yan-fu (2)· patent assignee history
2014–2019Based in Zhubei City, TW· patent location history
2017–2019Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (4)· patent assignee history
2017Based in Hsinchu County, TW· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
TAIWAN SEMICONDUCTOR MFG CO LTD42017–2019
TAIWAN SEMICONDUCTOR MFG32014–2015
CHIOU WEN-CHIH22014
LIN JING-CHENG22014
Lin yan-fuself22014
Locations
LocationPatentsSpan
Zhubei City, TW62014–2019
Hsinchu County, TW12017