Inventor

Tetsuya Fujisawa

Inventor

Kawasaki, JP

Overview

1998–2015

Patent span

Electricity

Primary field (CPC H)

Patents· 24 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1045%

H05KPrinted circuits20%

H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h109%

H01RElectrically-conductive connections5%

Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests5%

G01NInvestigating or analysing materials by determining their chemical or physical properties2%

G01RMeasuring electric variables2%

G06FElectric digital data processing2%

G06QInformation and communication technology [ict] specially adapted for administrative, commercial, financial, managerial or supervisory purposes2%

H01LSemiconductor devices2%

PatentTitleYear

9,076,789'Semiconductor device having a high frequency external connection electrode positioned within a via hole'2015 8,758,685'Automatic analyzer and operating method for same'2014 8,344,490'Semiconductor device having a high frequency electrode positioned with a via hole'2013 7,692,294'Semiconductor device and method for fabricating the same'2010 7,251,801'Method of designing circuit board'2007 7,247,950'Semiconductor device and method of manufacturing the same'2007 7,092,900'Electronic commerce method, recording medium storing electronic commerce program therein, and server'2006 6,836,025'Semiconductor device configured to be surface mountable'2004 6,784,543'External connection terminal and semiconductor device'2004 6,767,219'Contactor, method for manufacturing such contactor, and testing method using such contactor'2004 6,696,754'Semiconductor module including a plurality of semiconductor devices detachably'2004 6,566,239'Semiconductor device manufacturing method having a step of forming a post terminal on a wiring by electroless plating'2003 6,548,898'External connection terminal and semiconductor device'2003 6,476,503'Semiconductor device having columnar electrode and method of manufacturing same'2002 6,472,744'Semiconductor module including a plurality of semiconductor devices detachably'2002 6,433,418'Apparatus for a vertically accumulable semiconductor device with external leads secured by a positioning mechanism'2002 6,333,564'Surface mount type semiconductor device and method of producing the same having an interposing layer electrically connecting the semiconductor chip with protrusion electrodes'2001 6,094,356'Semiconductor device and semiconductor device module'2000 6,084,309'Semiconductor device and semiconductor device mounting structure'2000 6,060,768'Semiconductor device, method of manufacturing the semiconductor device, and method of manufacturing lead frame'2000 5,984,699'Method of fabricating a semiconductor device'1999 5,801,439'Semiconductor device and semiconductor device unit for a stack arrangement'1998 5,786,985'Semiconductor device and semiconductor device unit'1998 5,760,471'Semiconductor device having an inner lead extending over a central portion of a semiconductor device sealed in a plastic package and an outer lead exposed to the outside of a side face of the plastic package'1998

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1998–2007Patents assigned to FUJITSU LTD (20)· patent assignee history

1998–2015Based in Kawasaki, JP· patent location history

2010Patents assigned to FUJITSU MICROELECTRONICS LTD (1)· patent assignee history

2013–2014Patents assigned to FUJISAWA TETSUYA (2)· patent assignee history

2013–2015Patents assigned to FUJITSU SEMICONDUCTOR LTD (2)· patent assignee history

2013Patents assigned to AIBA YOSHITAKA (1)· patent assignee history

2014Based in Hitachinaka, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
FUJITSU LTD	20	1998–2007
FUJISAWA TETSUYAself	2	2013–2014
FUJITSU SEMICONDUCTOR LTD	2	2013–2015
AIBA YOSHITAKA	1	2013
FUJITSU MICROELECTRONICS LTD	1	2010

Locations

Location	Patents	Span
Kawasaki, JP	23	1998–2015
Hitachinaka, JP	1	2014